SLAS887C September   2014  – March 2021


  1. Features
  2. Applications
  3. Description
  4. Functional Block Diagram
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Signal Descriptions
    3. 7.3 Pin Multiplexing
    4. 7.4 Connection of Unused Pins
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Active Mode Supply Current (Into VCC) Excluding External Current
    5. 8.5 Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 8.6 Thermal Resistance Characteristics
    7. 8.7 Timing and Switching Characteristics
      1. 8.7.1  Reset Timing
        1. Reset Timing
      2. 8.7.2  Clock Specifications
        1. DCO in External Resistor Mode
        2. DCO in Internal Resistor Mode
        3. DCO Overall Tolerance Table
        4. DCO in Bypass Mode Recommended Operating Conditions
      3. 8.7.3  Wake-up Characteristics
        1. Wake-up Times From Low Power Modes
      4. 8.7.4  I/O Ports
        1. Schmitt-Trigger Inputs – General-Purpose I/O
        2. Inputs – Ports P1 and P2
        3. Leakage Current – General-Purpose I/O
        4. Outputs – General-Purpose I/O
        5. Output Frequency – General-Purpose I/O
        6. Typical Characteristics – Outputs
      5. 8.7.5  Power Management Module
        1. PMM, High-Side Brownout Reset (BORH)
        2. PMM, Low-Side SVS (SVSL)
        3. PMM, Core Voltage
        4. PMM, Voltage Monitor (VMON)
      6. 8.7.6  Reference Module
        1. Voltage Reference (REF)
        2. Temperature Sensor
      7. 8.7.7  SD24
        1. SD24 Power Supply and Recommended Operating Conditions
        2. SD24 Internal Voltage Reference
        3. SD24 External Voltage Reference
        4. SD24 Input Range
        5. SD24 Performance, Internal Reference (SD24REFS = 1, SD24OSRx = 256)
        6. SD24 Performance, External Reference (SD24REFS = 0, SD24OSRx = 256)
        7. Typical Characteristics
      8. 8.7.8  eUSCI
        1. eUSCI (UART Mode) Clock Frequency
        2. eUSCI (UART Mode) Deglitch Characteristics
        3. eUSCI (SPI Master Mode) Clock Frequency
        4. eUSCI (SPI Master Mode) Timing
        5. eUSCI (SPI Slave Mode) Timing
        6. eUSCI (I2C Mode) Timing
      9. 8.7.9  Timer_A
        1. Timer_A
      10. 8.7.10 Flash
        1. Flash Memory
      11. 8.7.11 Emulation and Debug
        1. JTAG and Spy-Bi-Wire Interface
  9. Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagrams
    3. 9.3  CPU
    4. 9.4  Instruction Set
    5. 9.5  Operating Modes
    6. 9.6  Interrupt Vector Addresses
    7. 9.7  Special Function Registers
    8. 9.8  Flash Memory
    9. 9.9  JTAG Operation
      1. 9.9.1 JTAG Standard Interface
      2. 9.9.2 Spy-Bi-Wire Interface
      3. 9.9.3 JTAG Disable Register
    10. 9.10 Peripherals
      1. 9.10.1 Clock System
      2. 9.10.2 Power-Management Module (PMM)
      3. 9.10.3 Digital I/O
      4. 9.10.4 Watchdog Timer (WDT)
      5. 9.10.5 Timer TA0
      6. 9.10.6 Timer TA1
      7. 9.10.7 Enhanced Universal Serial Communication Interface (eUSCI)
      8. 9.10.8 Hardware Multiplier
      9. 9.10.9 SD24
    11. 9.11 Input/Output Diagrams
      1. 9.11.1 Port P1, P1.0 to P1.3, Input/Output With Schmitt Trigger
      2. 9.11.2 Port P1, P1.4 to P1.7, Input/Output With Schmitt Trigger
      3. 9.11.3 Port P2, P2.0 to P2.2 and P2.4 to P2.7, Input/Output With Schmitt Trigger
      4. 9.11.4 Port P2, P2.3, Input/Output With Schmitt Trigger
    12. 9.12 Device Descriptor
    13. 9.13 Memory
      1. 9.13.1 Peripheral File Map
    14. 9.14 Identification
      1. 9.14.1 Device Identification
      2. 9.14.2 JTAG Identification
  10. 10Applications, Implementation, and Layout
  11. 11Device and Documentation Support
    1. 11.1 Getting Started and Next Steps
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation Support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Documentation Support

The following documents describe the MSP430i20xx MCUs. Copies of these documents are available on the Internet at

Receiving Notification of Document Updates

To receive notification of documentation updates—including silicon errata—go to the product folder for your device on (for example, MSP430i2041). In the upper right corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.


MSP430i2041 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430i2040 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430i2031 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430i2031 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430i2021 Device Erratasheet

Describes the known exceptions to the functional specifications.

MSP430i2021 Device Erratasheet

Describes the known exceptions to the functional specifications.

User's Guides

MSP430i2xx Family User's Guide

Detailed description of all modules and peripherals available in this device family.

MSP430™ Flash Device Bootloader (BSL) User's Guide

The MSP430 bootloader (BSL) lets users communicate with embedded memory in the MSP430 microcontroller during the prototyping phase, final production, and in service. Both the programmable memory (flash memory) and the data memory (RAM) can be modified as required. Do not confuse the bootloader with the bootstrap loader programs found in some digital signal processors (DSPs) that automatically load program code (and data) from external memory to the internal memory of the DSP.

MSP430 Programming With the JTAG Interface

This document describes the functions that are required to erase, program, and verify the memory module of the MSP430 flash-based and FRAM-based microcontroller families using the JTAG communication port. In addition, it describes how to program the JTAG access security fuse that is available on all MSP430 devices. This document describes device access using both the standard 4-wire JTAG interface and the 2-wire JTAG interface, which is also referred to as Spy-Bi-Wire (SBW).

MSP430 Hardware Tools User's Guide

This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the program development tool for the MSP430 ultra-low-power microcontroller. Both available interface types, the parallel port interface and the USB interface, are described.

Application Reports

MSP430 32-kHz Crystal Oscillators

Selection of the correct crystal, correct load circuit, and proper board layout are important for a stable crystal oscillator. This application report summarizes crystal oscillator function and explains the parameters to select the correct crystal for MSP430 ultra-low-power operation. In addition, hints and examples for correct board layout are given. The document also contains detailed information on the possible oscillator tests to ensure stable oscillator operation in mass production.

MSP430 System-Level ESD Considerations

System-level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low-power components. This application report addresses different ESD topics to help board designers and OEMs understand and design robust system-level designs.