SLAS887B September   2014  – March 2020

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
    3. 4.3 Pin Multiplexing
    4. 4.4 Connection of Unused Pins
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Active Mode Supply Current (Into VCC) Excluding External Current
    5. 5.5 Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6 Thermal Resistance Characteristics
    7. 5.7 Timing and Switching Characteristics
      1. 5.7.1  Reset Timing
        1. Table 5-1 Reset Timing
      2. 5.7.2  Clock Specifications
        1. Table 5-2 DCO in External Resistor Mode
        2. Table 5-3 DCO in Internal Resistor Mode
        3. Table 5-4 DCO Overall Tolerance Table
        4. Table 5-5 DCO in Bypass Mode Recommended Operating Conditions
      3. 5.7.3  Wake-up Characteristics
        1. Table 5-6 Wake-up Times From Low Power Modes
      4. 5.7.4  I/O Ports
        1. Table 5-7  Schmitt-Trigger Inputs – General-Purpose I/O
        2. Table 5-8  Inputs – Ports P1 and P2
        3. Table 5-9  Leakage Current – General-Purpose I/O
        4. Table 5-10 Outputs – General-Purpose I/O
        5. Table 5-11 Output Frequency – General-Purpose I/O
        6. 5.7.4.1    Typical Characteristics – Outputs
      5. 5.7.5  Power Management Module
        1. Table 5-12 PMM, High-Side Brownout Reset (BORH)
        2. Table 5-13 PMM, Low-Side SVS (SVSL)
        3. Table 5-14 PMM, Core Voltage
        4. Table 5-15 PMM, Voltage Monitor (VMON)
      6. 5.7.6  Reference Module
        1. Table 5-16 Voltage Reference (REF)
        2. Table 5-17 Temperature Sensor
      7. 5.7.7  SD24
        1. Table 5-18 SD24 Power Supply and Recommended Operating Conditions
        2. Table 5-19 SD24 Internal Voltage Reference
        3. Table 5-20 SD24 External Voltage Reference
        4. Table 5-21 SD24 Input Range
        5. Table 5-22 SD24 Performance, Internal Reference (SD24REFS = 1, SD24OSRx = 256)
        6. Table 5-23 SD24 Performance, External Reference (SD24REFS = 0, SD24OSRx = 256)
      8. 5.7.8  eUSCI
        1. Table 5-24 eUSCI (UART Mode) Clock Frequency
        2. Table 5-25 eUSCI (UART Mode) Deglitch Characteristics
        3. Table 5-26 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-27 eUSCI (SPI Master Mode) Timing
        5. Table 5-28 eUSCI (SPI Slave Mode) Timing
        6. Table 5-29 eUSCI (I2C Mode) Timing
      9. 5.7.9  Timer_A
        1. Table 5-30 Timer_A
      10. 5.7.10 Flash
        1. Table 5-31 Flash Memory
      11. 5.7.11 Emulation and Debug
        1. Table 5-32 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagrams
    3. 6.3  CPU
    4. 6.4  Instruction Set
    5. 6.5  Operating Modes
    6. 6.6  Interrupt Vector Addresses
    7. 6.7  Special Function Registers
      1. Table 6-4 Interrupt Enable 1 (Address = 00h)
      2. Table 6-5 Interrupt Flag Register 1 (Address = 02h)
    8. 6.8  Flash Memory
    9. 6.9  JTAG Operation
      1. 6.9.1 JTAG Standard Interface
      2. 6.9.2 Spy-Bi-Wire Interface
      3. 6.9.3 JTAG Disable Register
        1. Table 6-1 SYSJTAGDIS Register
    10. 6.10 Peripherals
      1. 6.10.1 Clock System
      2. 6.10.2 Power-Management Module (PMM)
      3. 6.10.3 Digital I/O
      4. 6.10.4 Watchdog Timer (WDT)
      5. 6.10.5 Timer TA0
      6. 6.10.6 Timer TA1
      7. 6.10.7 Enhanced Universal Serial Communication Interface (eUSCI)
      8. 6.10.8 Hardware Multiplier
      9. 6.10.9 SD24
    11. 6.11 Input/Output Diagrams
      1. 6.11.1 Port P1, P1.0 to P1.3, Input/Output With Schmitt Trigger
      2. 6.11.2 Port P1, P1.4 to P1.7, Input/Output With Schmitt Trigger
      3. 6.11.3 Port P2, P2.0 to P2.2 and P2.4 to P2.7, Input/Output With Schmitt Trigger
      4. 6.11.4 Port P2, P2.3, Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptor
    13. 6.13 Memory
      1. 6.13.1 Peripheral File Map
    14. 6.14 Identification
      1. 6.14.1 Device Identification
      2. 6.14.2 JTAG Identification
  7. 7Applications, Implementation, and Layout
  8. 8Device and Documentation Support
    1. 8.1 Getting Started and Next Steps
    2. 8.2 Device Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Support Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.1 Pin Diagrams

Figure 4-1 shows the pin assignments for the MSP430i2041 and MSP430i2040 devices in the RHB package.

MSP430i2041 MSP430i2040 MSP430i2031 MSP430i2030 MSP430i2021 MSP430i2020 MSP430i2040_32QFN.gif

NOTE:

TI recommends connecting the thermal pad on the RHB package to DVSS.
Figure 4-1 32-Pin RHB Package (Top View) – MSP430i2041, MSP430i2040

Figure 4-2 shows the pin assignments for the MSP430i2041 and MSP430i2040 devices in the PW package.

MSP430i2041 MSP430i2040 MSP430i2031 MSP430i2030 MSP430i2021 MSP430i2020 MSP430i2040_28SSOP.gifFigure 4-2 28-Pin PW Package (Top View) – MSP430i2041, MSP430i2040

Figure 4-3 shows the pin assignments for the MSP430i2031 and MSP430i2030 devices in the RHB package.

MSP430i2041 MSP430i2040 MSP430i2031 MSP430i2030 MSP430i2021 MSP430i2020 MSP430i2030_32QFN.gif

NOTE:

TI recommends connecting the thermal pad on the RHB package to DVSS.

NOTE:

TI recommends connecting NC pins to AVSS.
Figure 4-3 32-Pin RHB Package (Top View) – MSP430i2031, MSP430i2030

Figure 4-4 shows the pin assignments for the MSP430i2031 and MSP430i2030 devices in the PW package.

MSP430i2041 MSP430i2040 MSP430i2031 MSP430i2030 MSP430i2021 MSP430i2020 MSP430i2030_28SSOP.gif

NOTE:

TI recommends connecting NC pins to AVSS.
Figure 4-4 28-Pin PW Package (Top View) – MSP430i2031, MSP430i2030

Figure 4-5 shows the pin assignments for the MSP430i2021 and MSP430i2020 devices in the RHB package.

MSP430i2041 MSP430i2040 MSP430i2031 MSP430i2030 MSP430i2021 MSP430i2020 MSP430i2020_32QFN.gif

NOTE:

TI recommends connecting the thermal pad on the RHB package to DVSS.

NOTE:

TI recommends connecting NC pins to AVSS.
Figure 4-5 32-Pin RHB Package (Top View) – MSP430i2021, MSP430i2020

Figure 4-5 shows the pin assignments for the MSP430i2021 and MSP430i2020 devices in the PW package.

MSP430i2041 MSP430i2040 MSP430i2031 MSP430i2030 MSP430i2021 MSP430i2020 MSP430i2020_28SSOP.gif

NOTE:

TI recommends connecting NC pins to AVSS.
Figure 4-6 28-Pin PW Package (Top View) – MSP430i2021, MSP430i2020