SLLSEJ3A June   2015  – July 2015 ONET1130EC

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Function
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Electrical Characteristics
    6. 7.6 Transmitter AC Electrical Characteristics
    7. 7.7 Receiver AC Electrical Characteristics
    8. 7.8 Timing Requirements
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Transmitter
        1. 8.3.1.1 Equalizer
        2. 8.3.1.2 CDR
        3. 8.3.1.3 Modulator Driver
        4. 8.3.1.4 Modulation Current Generator
        5. 8.3.1.5 DC Offset Cancellation and Cross Point Control
        6. 8.3.1.6 Transmitter Loopback (Electrical Loopback)
        7. 8.3.1.7 Bias Current Generation and APC Loop
        8. 8.3.1.8 Laser Safety Features and Fault Recovery Procedure
      2. 8.3.2 Receiver
        1. 8.3.2.1 Equalizer
        2. 8.3.2.2 DC Offset Cancellation and Cross Point Control
        3. 8.3.2.3 CDR
        4. 8.3.2.4 Output Driver
        5. 8.3.2.5 Receiver Loopback (Optical Loopback)
        6. 8.3.2.6 Loss of Signal Detection
      3. 8.3.3 Analog Block
        1. 8.3.3.1 Analog Reference and Temperature Sensor
        2. 8.3.3.2 Power-On Reset
        3. 8.3.3.3 Analog to Digital Converter
        4. 8.3.3.4 2-Wire Interface and Control Logic
        5. 8.3.3.5 Bus Idle
        6. 8.3.3.6 Start Data Transfer
        7. 8.3.3.7 Stop Data Transfer
        8. 8.3.3.8 Data Transfer
      4. 8.3.4 Acknowledge
    4. 8.4 Device Functional Modes
      1. 8.4.1 Differential Transmitter Output
      2. 8.4.2 Single-Ended Transmitter Output
    5. 8.5 Programming
    6. 8.6 Register Mapping
      1. 8.6.1 R/W Control Registers
        1. 8.6.1.1 Core Level Register 0 (offset = 0100 0001 [reset = 41h]
        2. 8.6.1.2 Core Level Register 1 (offset = 0000 0000) [reset = 0h]
        3. 8.6.1.3 Core Level Register 2 (offset = 0000 0000 ) [reset = 0h]
        4. 8.6.1.4 Core Level Register 3 (offset = 0000 0000) [reset = 0h]
      2. 8.6.2 RX Registers
        1. 8.6.2.1 RX Register 4 (offset = 0000 0000) [reset = 0h]
        2. 8.6.2.2 RX Register 5 (offset = 0000 0000) [reset = 0h]
        3. 8.6.2.3 RX Register 6 (offset = 0000 0000) [reset = 0h]
        4. 8.6.2.4 RX Register 7 (offset = 0000 0000) [reset = 0h]
        5. 8.6.2.5 RX Register 8 (offset = 0000 0000) [reset = 0h]
        6. 8.6.2.6 RX Register 9 (offset = 0000 0000) [reset = 0h]
      3. 8.6.3 TX Registers
        1. 8.6.3.1  TX Register 10 (offset = 0000 0000) [reset = 0h]
        2. 8.6.3.2  TX Register 11 (offset = 0000 0000) [reset = 0h]
        3. 8.6.3.3  TX Register 12 (offset = 0000 0000) [reset = 0h]
        4. 8.6.3.4  TX Register 13 (offset = 0h) [reset = 0]
        5. 8.6.3.5  TX Register 14 (offset = 0000 0000) [reset = 0h]
        6. 8.6.3.6  TX Register 15 (offset = 0000 0000) [reset = 0h]
        7. 8.6.3.7  TX Register 16 (offset = 0000 0000) [reset = 0h]
        8. 8.6.3.8  TX Register 17 (offset = 0000 0000) [reset = 0h]
        9. 8.6.3.9  TX Register 18 (offset = 0000 0000) [reset = 0h]
        10. 8.6.3.10 TX Register 19 (offset = 0000 0000) [reset = 0h]
      4. 8.6.4 Reserved Registers
        1. 8.6.4.1 Reserved Registers 20-39
      5. 8.6.5 Read Only Registers
        1. 8.6.5.1 Core Level Register 40 (offset = 0000 0000) [reset = 0h]
        2. 8.6.5.2 Core Level Register 41 (offset = 0000 0000) [reset = 0h]
        3. 8.6.5.3 RX Registers 42 (offset = 0000 0000) [reset = 0h]
        4. 8.6.5.4 TX Register 43 (offset = 0000 0000) [reset = 0h]
      6. 8.6.6 Adjustment Registers
        1. 8.6.6.1 Adjustment Registers 44-50
        2. 8.6.6.2 Adjustment Register 51 (offset = 0100 0000) [reset = 40h]
  9. 9 Application Information and Implementations
    1. 9.1 Application Information
    2. 9.2 Typical Application, Transmitter Differential Mode
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
      4. 9.2.4 Typical Application, Transmitter Single-Ended Mode
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.