SBOS498F June   2010  – March 2023 OPA140 , OPA2140 , OPA4140

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA140
    5. 6.5 Thermal Information: OPA2140
    6. 6.6 Thermal Information: OPA4140
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Operating Voltage
      2. 7.3.2  Capacitive Load and Stability
      3. 7.3.3  Output Current Limit
      4. 7.3.4  Noise Performance
      5. 7.3.5  Basic Noise Calculations
      6. 7.3.6  Phase-Reversal Protection
      7. 7.3.7  Thermal Protection
      8. 7.3.8  Electrical Overstress
      9. 7.3.9  EMI Rejection
      10. 7.3.10 EMIRR +IN Test Configuration
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 Filter Design Tool
        4. 9.1.1.4 TI Reference Designs
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision E (July 2021) to Revision F (March 2023)

  • Changed OPA2140 DRG package from preview to production dataGo
  • Added ± to input offset voltage and input offset voltage drift values in the Electrical Characteristics Go
  • Changed 12-bit settling time specification unit from ns to µs in the Electrical Characteristics Go
  • Deleted incorrect power supply voltage parameter from the Electrical Characteristics and moved corrected values to the Recommended Operating Conditions Go
  • Added thermal-related information to the OPA2140 DRG package in the Thermal Protection sectionGo
  • Changed Figure 7-3 and Figure 7-4 for clarityGo
  • Changed Figure 8-3, Dual Operational Amplifier Board Layout for Noninverting Configuration to show the dual DRG package optionGo

Changes from Revision D (January 2019) to Revision E (July 2021)

  • Added OPA2140 DRG preview package and associated content to data sheetGo

Changes from Revision C (August 2016) to Revision D (January 2019)

  • Changed Figure 12 x-axis title From: Frequency (Hz) To: Output Amplitude (VRMS)Go

Changes from Revision B (November 2015) to Revision C (August 2016)

  • Changed units for En Input voltage noise From: μV To: nV in Electrical Characteristics: VS = 4.5 V to 36 V; ±2.25 V to ±18 VGo

Changes from Revision A (August 2010) to Revision B (November 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed title of Table 6-1 From: Characteristic Performance Measurements To: Table of Graphs Go
  • Changed section 7.37 title From: Power Dissipation and Thermal Protection To: Thermal Protection Go