SBOS556D June   2011  – August 2020 OPA171-Q1 , OPA2171-Q1 , OPA4171-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions : OPA171-Q1 and OPA2171-Q1
    2.     Pin Functions : OPA4171-Q1
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information — OPA171-Q1 and OPA2171-Q1
    5. 6.5 Thermal Information — OPA4171-Q1
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
      1. 6.7.1 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Characteristics
      2. 7.3.2 Phase-Reversal Protection
      3. 7.3.3 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
      1. 7.4.1 Common-Mode Voltage Range
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Electrical Overstress
    2. 8.2 Typical Application
      1. 8.2.1 Capacitive Load Drive Solution Using an Isolation Resistor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

VS = ±18 V, VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2, and CL = 100 pF (unless otherwise noted)

Table 6-1 Characteristic Performance Measurements
DESCRIPTIONFIGURE
Offset Voltage Production DistributionFigure 6-1
Offset Voltage Drift DistributionFigure 6-2
Offset Voltage vs TemperatureFigure 6-3
Offset Voltage vs Common-Mode VoltageFigure 6-4
Offset Voltage vs Common-Mode Voltage (Upper Stage)Figure 6-5
Offset Voltage vs Power SupplyFigure 6-6
IB and IOS vs Common-Mode VoltageFigure 6-7
Input Bias Current vs TemperatureFigure 6-8
Output Voltage Swing vs Output Current (Maximum Supply)Figure 6-9
CMRR and PSRR vs Frequency (Referred-to Input)Figure 6-10
CMRR vs TemperatureFigure 6-11
PSRR vs TemperatureFigure 6-12
0.1Hz to 10Hz NoiseFigure 6-13
Input Voltage Noise Spectral Density vs FrequencyFigure 6-14
THD+N Ratio vs FrequencyFigure 6-15
THD+N vs Output AmplitudeFigure 6-16
Quiescent Current vs TemperatureFigure 6-17
Quiescent Current vs Supply VoltageFigure 6-18
Open-Loop Gain and Phase vs FrequencyFigure 6-19
Closed-Loop Gain vs FrequencyFigure 6-20
Open-Loop Gain vs TemperatureFigure 6-21
Open-Loop Output Impedance vs FrequencyFigure 6-22
Small-Signal Overshoot vs Capacitive Load (100-mV Output Step)Figure 6-23, Figure 6-24
No Phase ReversalFigure 6-25
Positive Overload RecoveryFigure 6-26
Negative Overload RecoveryFigure 6-27
Small-Signal Step Response (100 mV)Figure 6-28, Figure 6-29
Large-Signal Step ResponseFigure 6-30, Figure 6-31
Large-Signal Settling Time (10-V Positive Step)Figure 6-32
Large-Signal Settling Time (10-V Negative Step)Figure 6-33
Short-Circuit Current vs TemperatureFigure 6-34
Maximum Output Voltage vs FrequencyFigure 6-35
Channel Separation vs FrequencyFigure 6-36