SBOS079C March   1999  – February 2023 OPA2277 , OPA277 , OPA4277

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA277
    5. 6.5 Thermal Information: OPA2277
    6. 6.6 Thermal Information: OPA4277
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Offset Voltage Adjustment
      3. 7.3.3 Input Protection
      4. 7.3.4 Input Bias Current Cancellation
      5. 7.3.5 EMI Rejection Ratio (EMIRR)
        1. 7.3.5.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Second-Order, Low-Pass Filter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Load Cell Amplifier
      3. 8.2.3 Thermocouple Low-Offset, Low-Drift Loop Measurement With Diode Cold Junction Compensation
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 DRM Package (8-Pin VSON)
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 DIP-Adapter-EVM
        4. 9.1.1.4 DIYAMP-EVM
        5. 9.1.1.5 TI Reference Designs
        6. 9.1.1.6 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DRM|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Feature Description

The OPAx277 series is unity-gain stable and free from unexpected output phase reversal, making these devices easy to use in a wide range of applications. Applications with noisy or high-impedance power supplies can require decoupling capacitors close to the device pins. In most cases 0.1-μF capacitors are adequate.

The OPAx277 series has low offset voltage and drift. To achieve highest performance, optimize the circuit layout and mechanical conditions. Offset voltage and drift can be degraded by small thermoelectric potentials at the operational amplifier inputs. Connections of dissimilar metals generate thermal potential, which can degrade the ultimate performance of the OPAx277 series. To cancel these thermal potentials, make sure that the thermal potentials are equal in both input pins.

  • Keep the thermal mass of the connections to the two input pins similar
  • Locate heat sources as far as possible from the critical input circuitry
  • Shield operational amplifier and input circuitry from air currents, such as cooling fans