SBOS563G May   2011  – June 2015 OPA2314 , OPA314 , OPA4314

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA314
    5. 6.5 Thermal Information: OPA2314
    6. 6.6 Thermal Information: OPA4314
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Input and ESD Protection
      4. 7.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 7.3.5 EMI Susceptibility and Input Filtering
      6. 7.3.6 Rail-to-Rail Output
      7. 7.3.7 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Configurations
      2. 8.1.2 Capacitive Load and Stability
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Amplifier Selection
        2. 8.2.2.2 Passive Component Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
        1. 11.1.1.1 DFN Package
    2. 11.2 Related Links
    3. 11.3 Community Resource
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DCK Package
5-Pin SC70
Top View
OPA314 OPA2314 OPA4314 po_sc70_bos406.gif
DRB Package1(1)
8-Pin DFN
Top View
OPA314 OPA2314 OPA4314 po_drb_dfn-8_bos563.gif
DBV Package
5-Pin SOT23
Top View
OPA314 OPA2314 OPA4314 po_sot23-5_bos406.gif
D or DGK Package
8-Pin SOIC or VSSOP
Top View
OPA314 OPA2314 OPA4314 po_so_msop_bos406.gif
PW Package
14-Pin TSSOP
Top View
OPA314 OPA2314 OPA4314 po_pw_tssop-14_bos563.gif
1. Pitch: 0.65 mm.
2. Connect thermal pad to V–. Pad size: 1.8 mm × 1.5 mm.

Pin Functions: OPA314

PIN I/O DESCRIPTION
NAME DBV DCK
+IN 3 1 I Noninverting input
–IN 4 3 I Inverting input
OUT 1 4 O Output
V+ 5 5 — Positive (highest) supply
V– 2 2 — Negative (lowest) supply

Pin Functions: OPA2314

PIN I/O DESCRIPTION
NAME DRB DGK D
+IN A 3 3 3 I Noninverting input
+IN B 5 5 5 I Noninverting input
–IN A 2 2 2 I Inverting input
–IN B 6 6 6 I Inverting input
OUT A 1 1 1 O Output
OUT B 7 7 7 O Output
V+ 8 8 8 — Positive (highest) supply
V– 4 4 4 — Negative (lowest) supply

Pin Functions: OPA4314

PIN I/O DESCRIPTION
NAME NO.
+IN A 3 I Noninverting input
+IN B 5 I Noninverting input
+IN C 10 I Noninverting input
+IN D 12 I Noninverting input
–IN A 2 I Inverting input
–IN B 6 I Inverting input
–IN C 9 I Inverting input
–IN D 13 I Inverting input
OUT A 1 O Output
OUT B 7 O Output
OUT C 8 O Output
OUT D 14 O Output
V+ 4 — Positive (highest) supply
V– 11 — Negative (lowest) supply