SBOS073C September 1997 – August 2016 OPA2340 , OPA340 , OPA4340
PRODUCTION DATA.
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| Voltage | Supply voltage | 5.5 | V | ||
| Signal input terminals(2) | –0.5 | 0.5 | |||
| Current | Signal input terminals(2) | 10 | mA | ||
| Output short circuit(3) | Continuous | ||||
| Temperature | Operating, TA | –55 | 125 | °C | |
| Junction, TJ | 150 | ||||
| Storage, Tstg | –55 | 125 | |||
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±600 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±250 | |||
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply voltage | 2.7 | 5.5 | V | |
| Specified temperature | –40 | 125 | °C | |
| THERMAL METRIC(1) | OPA340 | UNIT | ||||
|---|---|---|---|---|---|---|
| DBV (SOT-23) |
P (PDIP) |
D (SOIC) |
D (SOIC) |
|||
| 5 PINS | 8 PINS | 8 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 207.9 | 53.1 | 142 | 83.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 71.2 | 42.5 | 90.2 | 70.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 36.0 | 30.3 | 82.5 | 59.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 2.0 | 19.7 | 39.4 | 11.6 | °C/W |
| ψJB | Junction-to-board characterization parameter | 35.2 | 30.2 | 82 | 37.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | — | — | °C/W |
| THERMAL METRIC(1) | OPA2340 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) |
DGK (VSSOP) |
|||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 138.4 | 169.2 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 89.5 | 62.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 78.6 | 89.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 29.9 | 7.5 | °C/W |
| ψJB | Junction-to-board characterization parameter | 78.1 | 88.2 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |
| THERMAL METRIC(1) | OPA4340 | UNIT | |
|---|---|---|---|
| DBQ (SSOP) |
|||
| 16 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 115.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 67 | °C/W |
| RθJB | Junction-to-board thermal resistance | 58.3 | °C/W |
| ψJT | Junction-to-top characterization parameter | 19.9 | °C/W |
| ψJB | Junction-to-board characterization parameter | 57.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |
| PARAMETER | TEST CONDITIONS | MIN | TYP(1) | MAX | UNIT | ||
|---|---|---|---|---|---|---|---|
| OFFSET VOLTAGE | |||||||
| VOS | Input offset voltage | VS = 5 V | ±150 | ±500 | µV | ||
| dVOS/dt | Input offset voltage vs temperature | TA = –40°C to 85°C, VS = 5 V | ±2.5 | µV/°C | |||
| PSRR | Input offset voltage vs power supply | VS = 2.7 V to 5.5 V, VCM = 0 V | 30 | 120 | µV/V | ||
| Over temperature | VS = 2.7 V to 5.5 V, VCM = 0 V, TA = –40°C to 85°C, VS = 5 V |
120 | µV/°C | ||||
| Channel separation, DC | 0.2 | µV/V | |||||
| INPUT BIAS CURRENT | |||||||
| IS | Input bias current | ±0.2 | ±10 | pA | |||
| Over temperature | TA = –40°C to 85°C, VS = 5 V | ±60 | |||||
| IOS | Input offset current | ±0.2 | ±10 | pA | |||
| NOISE | |||||||
| Input voltage noise | f = 0.1 kHz to 50 kHz | 8 | µVRMS | ||||
| en | Input voltage noise density | f = 1 kHz | 25 | nV/√Hz | |||
| in | Current noise density | f = 1 kHz | 3 | fA/√Hz | |||
| INPUT VOLTAGE RANGE | |||||||
| VCM | Common-mode voltage range | –0.3 | (V+) + 0.3 | V | |||
| CMRR | Common-mode rejection ratio | –0.3 V < VCM < (V+) – 1.8 V | 80 | 92 | dB | ||
| VS = 5 V, –0.3 V < VCM < 5.3 V | 70 | 84 | |||||
| VS = 2.7 V, –0.3 V < VCM < 3 V | 66 | 80 | |||||
| INPUT IMPEDANCE | |||||||
| Differential | 1013 || 3 | Ω || pF | |||||
| Common-mode | 1013 || 6 | Ω || pF | |||||
| OPEN-LOOP GAIN | |||||||
| AOL | Open-loop voltage gain | RL = 100 kΩ, 5 mV < VO < (V+) – 5 mV |
106 | 124 | dB | ||
| RL = 10 kΩ, 5 mV < VO < (V+) – 50 mV |
100 | 120 | |||||
| RL = 2 kΩ, 200 mV < VO < (V+) – 200 mV |
94 | 114 | |||||
| Over temperature | RL = 100 kΩ, 5 mV < VO < (V+) – 5 mV, TA = –40°C to 85°C, VS = 5 V |
106 | |||||
| RL = 10 kΩ, 5 mV < VO < (V+) – 50 mV, TA = –40°C to 85°C, VS = 5 V |
100 | ||||||
| RL = 2 kΩ, 200 mV < VO < (V+) – 200 mV, TA = –40°C to 85°C, VS = 5 V |
94 | ||||||
| FREQUENCY RESPONSE | |||||||
| GBW | Gain-bandwidth product | G = 1 | 5.5 | MHz | |||
| SR | Slew rate | VS = 5 V, G = 1, CL = 100 pF | 6 | V/µs | |||
| Settling time, 0.1% | VS = 5 V, 2-V step, CL = 100 pF | 1 | µs | ||||
| Settling time, 0.01% | VS = 5 V, 2-V step, CL = 100 pF | 1.6 | µs | ||||
| Overload recovery time | VIN × G = VS | 0.2 | µs | ||||
| THD+N | Total harmonic distortion + noise | VS = 5 V, VO = 3VPP(2), G = 1, f = 1 kHz |
0.0007% | ||||
| OUTPUT | |||||||
| Voltage output swing from rail(2) | RL = 100 kΩ, AOL ≥ 106 dB | 1 | 5 | mV | |||
| RL = 10 kΩ, AOL ≥ 106 dB | 10 | ||||||
| RL = 2 kΩ, AOL ≥ 106 dB | 40 | ||||||
| Over temperature | RL = 100 kΩ, AOL ≥ 106 dB, TA = –40°C to 85°C, VS = 5 V |
5 | |||||
| RL = 10 kΩ, AOL ≥ 106 dB, TA = –40°C to 85°C, VS = 5 V |
50 | ||||||
| RL = 2 kΩ, AOL ≥ 106 dB, TA = –40°C to 85°C, VS = 5 V |
200 | ||||||
| ISC | Short-circuit current | ±50 | mA | ||||
| CLOAD | Capacitive load drive | See Typical Characteristics | |||||
| POWER SUPPLY | |||||||
| VS | Specified voltage range | 2.7 | 5 | V | |||
| Operating voltage range | Lower end | 2.5 | V | ||||
| Higher end | 5.5 | ||||||
| IQ | Quiescent current (per amplifier) |
IO = 0, VS = 5 V | 750 | 950 | µA | ||
| Over temperature | IO = 0, VS = 5 V, TA = –40°C to 85°C | 100 | |||||
| TEMPERATURE RANGE | |||||||
| Specified range | –40 | 85 | °C | ||||
| Operating range | –55 | 125 | °C | ||||
| Storage range | –55 | 125 | °C | ||||
Figure 1. Open-Loop Gain/Phase vs Frequency
Figure 3. Input Voltage and Current Noise Spectral Density vs Frequency
Figure 5. Total Harmonic Distortion + Noise vs Frequency
Figure 7. Open-Loop Gain and Power-Supply Rejection vs Temperature
Figure 9. Quiescent Current vs Temperature
Figure 11. Short-Circuit Current vs Temperature
Figure 13. Input Bias Current vs Temperature
Figure 15. Output Voltage Swing vs Output Current
Figure 17. Offset Voltage Production Distribution
| CL = 100 pF |
Figure 21. Small-Signal Overshoot vs Load Capacitance
Figure 2. Power-Supply and Common-Mode Rejection vs Frequency
Figure 4. Channel Separation vs Frequency
Figure 6. Closed-Loop Output Impedance vs Frequency
Figure 8. Common-Mode Rejection vs Temperature
Figure 10. Quiescent Current vs Supply Voltage
Figure 12. Short-Circuit Current vs Supply Voltage
Figure 14. Input Bias Current vs Input Common-Mode Voltage
Figure 16. Maximum Output Voltage vs Frequency
Figure 18. Offset Voltage Drift Magnitude Production Distribution
| CL = 100 pF |
Figure 22. Settling Time vs Closed-Loop Gain