SBOS937D October   2020  – December 2023 OPA3S328

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Diagram
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Switch Characterization Configurations
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Operating Voltage
      2. 7.3.2 Input and ESD Protection
      3. 7.3.3 Programmable Switches
      4. 7.3.4 Rail-to-Rail Input
      5. 7.3.5 Phase Reversal
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Load and Stability
      2. 8.1.2 EMI Susceptibility and Input Filtering
      3. 8.1.3 Transimpedance Amplifier
        1. 8.1.3.1 Optimizing the Transimpedance Circuit
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 9.1.1.3 TI Reference Designs
        4. 9.1.1.4 Filter Design Tool
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision C (August 2023) to Revision D (December 2023)

  • Changed OPA3S328 YBJ (DSBGA, 24) package status from advanced information (preview with samples) to production data (active)Go

Changes from Revision B (November 2021) to Revision C (August 2023)

  • Changed OPA3S328 YBJ (DSBGA, 24) package status from preview (no samples) to advanced information (preview with samples)Go
  • Changed the ESD rating to the bidirectional valueGo
  • Changed open-loop output impedance symbol from Ro to ZoGo

Changes from Revision A (September 2021) to Revision B (November 2021)

  • Changed YBJ preview Figure 5-2 to correct pin configurationGo
  • Changed YBJ package name from QFN-20 (typo) to DSBGA-24 in note (1) of Table 5-2 and Table 5-3Go

Changes from Revision * (October 2020) to Revision A (September 2021)

  • Changed OPA3S328 RGR (VQFN-20) package status from advanced information (preview) to production data (active)Go