SBOS787 August   2016 OPA657-DIE

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Electrostatic Discharge Caution
  5. 5Bare Die Information

Package Options

Mechanical Data (Package|Pins)
  • TD|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • High Gain Bandwidth Product: 1.6 GHz
  • High Bandwidth 275 MHz (G = 10)
  • Slew Rate 700 V/µs (G = 10, 1-V Step)
  • Low-Input Offset Voltage: ±250 µV
  • Low-Input Bias Current: 2 pA
  • Low-Input Voltage Noise: 4.8 nV/√Hz
  • High-Output Current: 70 mA
  • Fast Overdrive Recovery

2 Applications

  • Wideband Photodiode Amplifiers
  • Wafer Scanning Equipment
  • ADC Input Amplifiers
  • Test and Measurement Front Ends
  • High Gain Precision Amplifiers
  • Optical Time Domain Reflectometry (OTDR)

3 Description

The OPA657 device combines a high gain-bandwidth, low-distortion, voltage-feedback operational amplifier with a low voltage noise JFET-input stage to offer a very high dynamic range amplifier for high-precision analog-to-digital converter (ADC) driving or wideband transimpedance applications. Photodiode applications achieve improved noise and bandwidth using this decompensated, high gain-bandwidth amplifier.

Very low level signals can be significantly amplified in a single OPA657 gain stage with exceptional bandwidth and accuracy. The very low input bias current and capacitance supports this performance even for relatively high source impedance. Broadband photodetector applications benefit from the low voltage noise JFET inputs for the OPA657. The JFET input contributes virtually no current noise, which makes the device ideal for high-gain photodiode applications.

Ordering Information(1)

PRODUCT PACKAGE
DESIGNATOR		 PACKAGE ORDERABLE PART NUMBER PACKAGE QUANTITY
OPA657 TD Bare Die in Gel Pak VR(2) OPA657TD1 324
OPA657TD2 10
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.