SBOS293J December   2003  – March 2025 OPA695

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics VS = ±5 V, OPA695ID, OPA695IDBV, OPA695DSG
    6. 5.6  Electrical Characteristics VS = 5 V, OPA695ID, OPA695IDBV, OPA695DSG
    7. 5.7  Electrical Characteristics VS = ±5 V, OPA695IDGK
    8. 5.8  Electrical Characteristics VS = 5 V, OPA695IDGK
    9. 5.9  Typical Characteristics: VS = ±5 V, OPA695IDBV, OPA695ID, OPA695DSG
    10. 5.10 Typical Characteristics: VS = 5 V, OPA695IDBV, OPA695ID, OPA695DSG
    11. 5.11 Typical Characteristics: VS = ±5 V, OPA695IDGK
    12. 5.12 Typical Characteristics: VS = 5 V, OPA695IDGK
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Wideband Current-Feedback Operation
      2. 6.3.2 Input and ESD Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Operating Suggestions
        1. 7.1.1.1 Setting Resistor Values to Optimize Bandwidth
        2. 7.1.1.2 Output Current and Voltage
        3. 7.1.1.3 Driving Capacitive Loads
        4. 7.1.1.4 Distortion Performance
        5. 7.1.1.5 Noise Performance
        6. 7.1.1.6 Thermal Analysis
      2. 7.1.2 LO Buffer Amplifier
      3. 7.1.3 Wideband Cable Driving Applications
        1. 7.1.3.1 Cable Modem Return Path Driver
        2. 7.1.3.2 Arbitrary Waveform Driver
      4. 7.1.4 Differential I/O Applications
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Saw Filter Buffer
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Design-In Tools
        1. 8.1.1.1 Demonstration Fixtures
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DBV|6
  • DGK|8
  • DSG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

OPA695 D Package, 8-Pin SOIC, and DGK Package, 8-Pin VSSOP (Top View)Figure 4-1 D Package, 8-Pin SOIC, and DGK Package, 8-Pin VSSOP (Top View)
OPA695 DSG Package, 8-Pin WSON With Exposed Thermal Pad (Top View)Figure 4-3 DSG Package, 8-Pin WSON With Exposed Thermal Pad (Top View)
OPA695 DBV Package, 6-Pin SOT-23 (Top View)Figure 4-2 DBV Package, 6-Pin SOT-23 (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
D (SOIC),
DGK (VSSOP)		 DBV (SOT-23) DSG (WSON)
DIS 8 5 8 I Not disable (enable)
Feedback — — 1 — Feedback connection to output of amplifier
Inverting input 2 4 3 I Inverting input
NC 1, 5 — 2 — Not connected
Noninverting input 3 3 4 I Noninverting input
Output 6 1 6 O Output
–VS 4 2 5 P Negative supply
+VS 7 6 7 P Positive supply
Thermal pad — — — Connect the thermal pad to –VS
(1) I = input, O = output, P = power.