SBOSA77A March   2023  – April 2024 OPA928

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics: 4.5V ≤ VS < 8V
    6. 5.6 Electrical Characteristics: 8V ≤ VS ≤ 16V
    7. 5.7 Electrical Characteristics: 16V < VS ≤ 36V
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Guard Buffer
      2. 6.3.2 Input Protection
      3. 6.3.3 Thermal Protection
      4. 6.3.4 Capacitive Load and Stability
      5. 6.3.5 EMI Rejection
      6. 6.3.6 Common-Mode Voltage Range
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Contamination Considerations
      2. 7.1.2 Guarding Considerations
      3. 7.1.3 Single-Supply Considerations
      4. 7.1.4 Humidity Considerations
      5. 7.1.5 Dielectric Relaxation
      6. 7.1.6 Shielding
    2. 7.2 Typical Applications
      1. 7.2.1 High-Impedance Amplifier
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Transimpedance Amplifier
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Input Bias
          2. 7.2.2.2.2 Offset Voltage
          3. 7.2.2.2.3 Stability
          4. 7.2.2.2.4 Noise
      3. 7.2.3 Improved Diode Limiter
      4. 7.2.4 Instrumentation Amplifier
    3. 7.3 Power-Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 8.1.1.3 TI Reference Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1.6 Shielding

High-impedance, femtoampere-level circuits are highly sensitive to electrostatic and electromagnetic interference (EMI). Even weak electric fields can couple into high-impedance nodes and cause significant interference when in close proximity to the circuit. Simply waving your hand near the test fixture, for example, can disrupt the low leakage measurement. To help reduce the effects of electrostatic and electromagnetic fields, fully enclose all exposed high-impedance traces with a shield. The shield serves to reduce external dc and ac signals from coupling into the high-impedance nodes by shunting the signals to analog ground. Keep the shield installed to reduce unwanted pickup and prevent contaminants from entering sensitive nodes. Shield cans and surface mount shield clips are readily available from manufactures.