SLAS759B August   2012  – January 2016 PCM5141 , PCM5142

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
    1. 6.1 Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: SCK Input
    7. 7.7  Timing Requirements: PCM Audio Data
      1. 7.7.1 Timing Requirements: I2S Master
    8. 7.8  Timing Requirements: XSMT
    9. 7.9  Switching Characteristics
    10. 7.10 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Terminology
      2. 8.3.2 Audio Data Interface
        1. 8.3.2.1 Audio Serial Interface
        2. 8.3.2.2 PCM Audio Data Formats
        3. 8.3.2.3 Zero Data Detect
      3. 8.3.3 XSMT Pin (Soft Mute / Soft Un-Mute)
      4. 8.3.4 Audio Processing
        1. 8.3.4.1 PCM514x Audio Processing Options
          1. 8.3.4.1.1 Overview
          2. 8.3.4.1.2 miniDSP Instruction Register
          3. 8.3.4.1.3 Digital Output
          4. 8.3.4.1.4 Software
        2. 8.3.4.2 Interpolation Filter
        3. 8.3.4.3 Fixed Audio Processing Flow (Program 5)
          1. 8.3.4.3.1 Processing Blocks - Detailed Descriptions
          2. 8.3.4.3.2 Biquad Section
          3. 8.3.4.3.3 Dynamic Range Compression
          4. 8.3.4.3.4 Stereo Mixer
          5. 8.3.4.3.5 Stereo Multiplexer
          6. 8.3.4.3.6 Mono Mixer
          7. 8.3.4.3.7 Master Volume Control
          8. 8.3.4.3.8 Miscellaneous Coefficients
      5. 8.3.5 DAC Outputs
        1. 8.3.5.1 Analog Outputs
        2. 8.3.5.2 Recommended Output Filter for the PCM514x
        3. 8.3.5.3 Choosing Between VREF and VCOM Modes
          1. 8.3.5.3.1 Voltage Reference and Output Levels
          2. 8.3.5.3.2 Mode Switching Sequence, from VREF Mode to VCOM Mode
        4. 8.3.5.4 Digital Volume Control
          1. 8.3.5.4.1 Emergency Ramp-Down
        5. 8.3.5.5 Analog Gain Control
      6. 8.3.6 Reset and System Clock Functions
        1. 8.3.6.1 Clocking Overview
        2. 8.3.6.2 Clock Slave Mode With Master and System Clock (SCK) Input (4 Wire I2S)
        3. 8.3.6.3 Clock Slave Mode With BCK PLL to Generate Internal Clocks (3-Wire PCM)
        4. 8.3.6.4 Clock Generation Using the PLL
        5. 8.3.6.5 PLL Calculation
          1. 8.3.6.5.1 Examples:
            1. 8.3.6.5.1.1 Recommended PLL Settings
        6. 8.3.6.6 Clock Master Mode from Audio Rate Master Clock
        7. 8.3.6.7 Clock Master from a Non-Audio Rate Master Clock
    4. 8.4 Device Functional Modes
      1. 8.4.1 Choosing a Control Mode
        1. 8.4.1.1 Software Control
          1. 8.4.1.1.1 SPI Interface
            1. 8.4.1.1.1.1 Register Read and Write Operation
          2. 8.4.1.1.2 I2C Interface
            1. 8.4.1.1.2.1 Slave Address
            2. 8.4.1.1.2.2 Register Address Auto-Increment Mode
            3. 8.4.1.1.2.3 Packet Protocol
            4. 8.4.1.1.2.4 Write Register
            5. 8.4.1.1.2.5 Read Register
            6. 8.4.1.1.2.6 Timing Characteristics
      2. 8.4.2 VREF and VCOM Modes
    5. 8.5 Programming
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Distribution and Requirements
    2. 10.2 Recommended Powerdown Sequence
      1. 10.2.1 XSMT = 0
      2. 10.2.2 Clock Error Detect
      3. 10.2.3 Planned Shutdown
      4. 10.2.4 Unplanned Shutdown
    3. 10.3 External Power Sense Undervoltage Protection Mode
    4. 10.4 Power-On Reset Function
      1. 10.4.1 Power-On Reset, DVDD 3.3-V Supply
      2. 10.4.2 Power-On Reset, DVDD 1.8-V Supply
    5. 10.5 PCM514x Power Modes
      1. 10.5.1 Setting Digital Power Supplies and I/O Voltage Rails
      2. 10.5.2 Power Save Modes
      3. 10.5.3 Power Save Parameter Programming
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Register Maps
    1. 12.1 PCM514x Register Map
      1. 12.1.1 Detailed Register Descriptions
        1. 12.1.1.1 Register Map Summary
        2. 12.1.1.2 Page 0 Registers
        3. 12.1.1.3 Page 1 Registers
        4. 12.1.1.4 Page 44 Registers
        5. 12.1.1.5 Page 253 Registers
      2. 12.1.2 PLL Tables for Software Controlled Devices
      3. 12.1.3 Coefficient Data Formats
      4. 12.1.4 Power Down and Reset Behavior
  13. 13Device and Documentation Support
    1. 13.1 Development Support
    2. 13.2 Documentation Support
    3. 13.3 Related Links
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

  • The PCM514x family of devices are simple to layout. Most engineers use a shared common ground for an entire device. GND can consider AGND and DGND connected.
  • Good system partitioning should keep digital clock and interface traces away from the analog outputs for highest analog performance. This reduces any high-speed clock return currents influencing the analog outputs.
  • Power supply and charge pump decoupling capacitors should be placed as close as possible to the device.
  • The top layer should be used for routing signals, whilst the bottom layer can be used for GND.

11.2 Layout Example

PCM5141 PCM5142 DatasheetLayoutExample_slas759.gif
It is recommended to place a top layer ground pour for shielding around the DAC and connect to lower main PCB ground plane by multiple vias
Figure 87. PCM514x Layout Example