SBOS392I August   2007  – April 2026

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Thermal Hysteresis
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Start-Up Time
      2. 8.3.2 Low Temperature Drift
      3. 8.3.3 Power Dissipation
      4. 8.3.4 Noise Performance
    4. 8.4 Device Functional Modes
  10. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 REF3312 in a Bipolar Signal-Chain Configuration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Op Amp Level-Shift Design
          2. 9.2.1.2.2 Differential Input Attenuator Design
          3. 9.2.1.2.3 Input Filtering
          4. 9.2.1.2.4 Component Selection
            1. 9.2.1.2.4.1 Voltage References
            2. 9.2.1.2.4.2 Op Amp
          5. 9.2.1.2.5 Input Attenuation and Level Shifting
          6. 9.2.1.2.6 Input Filtering
          7. 9.2.1.2.7 Passive Component Tolerances and Materials
        3. 9.2.1.3 Application Curves
          1. 9.2.1.3.1 DC Performance
          2. 9.2.1.3.2 AC Performance
    3. 9.3 Power-Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision H (August 2019) to Revision I (April 2026)

  • Updated the numbering format for tables, figures, equations, and cross-references throughout the document Go
  • Moved the REF3312, REF3318, REF3320, REF3325, REF3330, and REF3333 devices to the REF33 product folder on TI.com and updated the datasheet headerGo
  • Changed Device Information table to Package Information Go

Changes from Revision G (December 2016) to Revision H (August 2019)

  • Changed maximum operating current value in Recommended Operating Conditions sectionGo
  • Changed table title to REF33xx (REF3312, REF3320, REF3325, REF3330, REF3333, REF3340) Go