SNAS856A September 2024 – March 2025 REF80
PRODUCTION DATA
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Device Comparison Table
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Parameter Measurement Information
- 9 Application and Implementation
- 10Device and Documentation Support
- 11Revision History
- 12Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- NAJ|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information
6.6 Typical Characteristics
At TA = 25°C, VIN = 10V, VHET = 30V, CREF_Z = 10μF, CVDD = 1μF, (unless otherwise noted)
Figure 6-1 Long-Term Stability 
Figure 6-3 Temperature Drift Distribution
Figure 6-5 Supply
Current (IVDD) vs Temperature
Figure 6-7 Startup Heater Current IHET vs Time
Figure 6-9 0.1Hz
to 10Hz Voltage Noise Distribution 
Figure 6-11 Solder
Shift Distribution
Figure 6-13 Thermal Hysteresis (Cycle 2) DistributionTA = 0°C to 70°C
Figure 6-15 Power-Supply Rejection Ratio vs Frequency 
Figure 6-2 VREF_Z Vs Free-Air Temperature
Figure 6-4 Accuracy Distribution 
Figure 6-6 Steady
State Heater Current IHET vs Temperature
Figure 6-8 Startup Heater Current (Zoomed View) IHET vs Time
Figure 6-10 Noise
Density vs Frequency
Figure 6-12 Thermal Hysteresis (Cycle 1) Distribution TA = 0°C to 70°C
Figure 6-14 Startup Behavior
Figure 6-16 Heater Supply Rejection Ratio vs Frequency