SLASE18A September   2015  – November 2015 RF430CL331H

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Typical Application
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagrams
    2. 3.2 Pin Attributes
    3. 3.3 Signal Descriptions
    4. 3.4 Pin Multiplexing
    5. 3.5 Connections for Unused Pins
  4. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Recommended Operating Conditions, Resonant Circuit
    5. 4.5 Supply Currents
    6. 4.6 Electrical Characteristics, Digital Inputs
    7. 4.7 Electrical Characteristics, Digital Outputs
    8. 4.8 Thermal Characteristics
    9. 4.9 Timing and Switching Characteristics
      1. 4.9.1 Reset Timing
      2. 4.9.2 Serial Communication Protocol Timing
      3. 4.9.3 RF143B NFC/RFID Analog Front End
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Terms and Acronyms
    4. 5.4  Serial Communication Interface
    5. 5.5  Communication Protocol
    6. 5.6  I2C Protocol
      1. 5.6.1 I2C Examples
        1. 5.6.1.1 I2C Write
        2. 5.6.1.2 I2C Read
      2. 5.6.2 BIP-8 Communication Mode With I2C
    7. 5.7  NFC Type 4B Tag Platform
      1. 5.7.1 ISO/IEC 14443-3 Commands
      2. 5.7.2 NFC Tag Type 4 Commands
      3. 5.7.3 Data Rate Settings
    8. 5.8  NDEF Structure
    9. 5.9  Typical Operation
      1. 5.9.1 NDEF or Capability Container Select Procedure
      2. 5.9.2 NDEF or Capability Container Read Binary Procedure
        1. 5.9.2.1 NDEF Read Command Internal Buffer Handling
        2. 5.9.2.2 NDEF Read Command Internal Buffer Handling (With Caching)
      3. 5.9.3 NDEF or Capability Container Read Procedure (Prefetch Feature)
        1. 5.9.3.1 NDEF Read Command With Prefetch Internal Buffer Handling
      4. 5.9.4 NDEF or Capability Container Write Procedure (Blocking)
        1. 5.9.4.1 NDEF Write Command (Blocking) Internal Buffer Handling
      5. 5.9.5 NDEF or Capability Container Write Procedure (Nonblocking)
        1. 5.9.5.1 NDEF Write Procedure (Nonblocking) Internal Buffer Handling
    10. 5.10 RF Command Response Timing Limits
    11. 5.11 Registers
      1. 5.11.1  General Control Register
      2. 5.11.2  Status Register
      3. 5.11.3  Interrupt Registers
      4. 5.11.4  CRC Registers
      5. 5.11.5  Communication Watchdog Register
      6. 5.11.6  Version Register
      7. 5.11.7  NDEF File Identifier Register
      8. 5.11.8  Host Response Register
      9. 5.11.9  NDEF Block Length Register
      10. 5.11.10 NDEF File Offset Register
      11. 5.11.11 Buffer Start Register
      12. 5.11.12 SWTX Register
      13. 5.11.13 Custom Status Word Response Register
    12. 5.12 Identification
      1. 5.12.1 Revision Identification
      2. 5.12.2 Device Identification
      3. 5.12.3 JTAG Identification
      4. 5.12.4 Software Identification
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Diagram
    2. 6.2 References
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Getting Started and Next Steps
      2. 7.1.2 Device and Development Tool Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Export Control Notice
    7. 7.7 Glossary
  8. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.