SLAS834C November   2012  – December 2014 RF430FRL152H , RF430FRL153H , RF430FRL154H


  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
    3. 4.3 Pin Multiplexing
    4. 4.4 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Recommended Operating Conditions, Resonant Circuit
    5. 5.5  Active Mode Supply Current Into VDDB Excluding External Current
    6. 5.6  Low-Power Mode Supply Current (Into VDDB) Excluding External Current
    7. 5.7  Digital I/Os (P1, RST/NMI)
    8. 5.8  High-Frequency Oscillator (4 MHz), HFOSC
    9. 5.9  Low-Frequency Oscillator (256 kHz), LFOSC
    10. 5.10 Wake-Up From Low-Power Modes
    11. 5.11 Timer_A
    12. 5.12 eUSCI (SPI Master Mode) Recommended Operating Conditions
    13. 5.13 eUSCI (SPI Master Mode)
    14. 5.14 eUSCI (SPI Slave Mode)
    15. 5.15 eUSCI (I2C Mode)
    16. 5.16 FRAM
    17. 5.17 JTAG
    18. 5.18 RFPMM, Power Supply Switch
    19. 5.19 RFPMM, Bandgap Reference
    20. 5.20 RFPMM, Voltage Doubler
    21. 5.21 RFPMM, Voltage Supervision
    22. 5.22 SD14, Performance
    23. 5.23 SVSS Generator
    24. 5.24 Thermistor Bias Generator
    25. 5.25 Temperature Sensor
    26. 5.26 RF13M, Power Supply and Recommended Operating Conditions
    27. 5.27 RF13M, ISO/IEC 15693 ASK Demodulator
    28. 5.28 RF13M, ISO/IEC 15693 Compliant Load Modulator
  6. 6Detailed Description
    1. 6.1 CPU
    2. 6.2 Instruction Set
    3. 6.3 Operating Modes
    4. 6.4 Interrupt Vector Addresses
    5. 6.5 Memory
      1. 6.5.1 FRAM
      2. 6.5.2 SRAM
      3. 6.5.3 Application ROM
    6. 6.6 Peripherals
      1. 6.6.1  Digital I/O, (P1.x)
      2. 6.6.2  Versatile I/O Port P1
      3. 6.6.3  Oscillator and System Clock
      4. 6.6.4  Compact System Module (C-SYS_A)
      5. 6.6.5  Watchdog Timer (WDT_A)
      6. 6.6.6  Reset, NMI, SVMOUT System
      7. 6.6.7  Timer_A (Timer0_A3)
      8. 6.6.8  Enhanced Universal Serial Communication Interface (eUSCI_B0)
      9. 6.6.9  ISO/IEC 15693 Analog Front End (RF13M)
      10. 6.6.10 ISO/IEC 15693 Decoder/Encoder (RF13M)
      11. 6.6.11 CRC16 Module (CRC16)
      12. 6.6.12 14-Bit Sigma-Delta ADC (SD14)
      13. 6.6.13 Programmable Gain Amplifier (SD14)
      14. 6.6.14 Peripheral Register Map
    7. 6.7 Port Schematics
      1. 6.7.1 Port P1.0 Input/Output
      2. 6.7.2 Port P1.1 Input/Output
      3. 6.7.3 Port P1.2 Input/Output
      4. 6.7.4 Port P1.3 Input/Output
      5. 6.7.5 Port P1.4 Input/Output
      6. 6.7.6 Port P1.5 Input/Output
      7. 6.7.7 Port P1.6 Input/Output
      8. 6.7.8 Port P1.7 Input/Output
    8. 6.8 Device Descriptors (TLV)
  7. 7Applications, Implementation, and Layout
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device and Development Tool Nomenclature
    2. 8.2 Documentation Support
    3. 8.3 Related Links
    4. 8.4 Community Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Device and Documentation Support

8.1 Device Support

8.1.1 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. The tool's support documentation is electronically available within the Code Composer Studio™ Integrated Development Environment (IDE).

For an overview of the development tool and driver support for NFC transponders, visit the Tools & Software for NFC / RFID page.

8.1.2 Device and Development Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all RF430 MCU devices and support tools. Each commercial family member has one of three prefixes: RF, P, or X (for example, RF430FRL152H). Texas Instruments recommends two of three possible prefix designators for its support tools: RF and X. These prefixes represent evolutionary stages of product development from engineering prototypes (with X for devices and tools) through fully qualified production devices and tools (with RF for devices tools).

Device development evolutionary flow:

X – Experimental device that is not necessarily representative of the final device's electrical specifications

P – Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification

RF – Fully qualified production device

Support tool development evolutionary flow:

X – Development-support product that has not yet completed Texas Instruments internal qualification testing.

RF – Fully-qualified development-support product

X and P devices and X development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

RF devices and RF development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X and P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGE) and temperature range (for example, T). Figure 8-1 provides a legend for reading the complete device name for any family member.

Part_Number_Decoder_RF430.gifFigure 8-1 Device Nomenclature

8.2 Documentation Support

The following documents describe the RF430FRL15xH devices.

    SLAU506RF430FRL15xH Family Technical Reference Manual. Detailed description of all modules and peripherals available in this device family.
    SLAU603RF430FRL15xH Firmware User's Guide. Detailed description of the firmware that is provided for these devices.

8.3 Related Links

Table 8-1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 8-1 Related Links

RF430FRL152H Click here Click here Click here Click here Click here
RF430FRL153H Click here Click here Click here Click here Click here
RF430FRL154H Click here Click here Click here Click here Click here

8.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow engineers.

TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

8.5 Trademarks

MSP430, Code Composer Studio, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

8.6 Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.7 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.