SCLS010F December   1982  – May 2022 SN54HC688 , SN74HC688

PRODUCTION DATA  

  1. Features
  2. Description
  3. Revision History
  4. Pin Configuration and Functions
  5. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions (1)
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics
    6. 5.6 Operating Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. Power Supply Recommendations
  9. Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|20
  • FK|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

These identity comparators perform comparisons of two 8-bit binary or BCD words. An output-enable (OE) input may be used to force the output to the high level.

Device Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM)
SN74HC688DW SOIC (20) 12.80 mm × 7.50 mm
SN74HC688N PDIP (20) 25.40 mm × 6.35 mm
SN74HC688PWR TSSOP (20) 6.50 mm × 4.40 mm
SN54HC688J CDIP (20) 26.92 mm × 6.92 mm
SNJ54HC688FK LCCC (20) 8.89 mm × 8.45 mm
For all available packages, see the orderable addendum at the end of the data sheet.
GUID-20211006-SS0I-T2X0-JKJV-W1MPCV3G4S9R-low.png Functional Block Diagram