SLLS447D October   2000  – April 2024 SN65LBC172A , SN75LBC172A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Dissipation Rating Table
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Device Functional Modes
      1. 7.1.1 Function Table
      2. 7.1.2 Equivalent Input and Output Schematic Diagrams
  9. 8 Application and Implementation
    1. 8.1 Application Information
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
  • N|16
  • DW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information

THERMAL METRIC(1) N (PDIP) DW (SOIC) DW (SOIC) UNIT
16 PINS 16 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 60.6 71.1 66.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.1 37.4 34.4 °C/W
RθJB Junction-to-board thermal resistance 40.6 36.8 39.7 °C/W
ψJT Junction-to-top characterization parameter 27.5 13.3 8.9 °C/W
ψJB Junction-to-board characterization parameter 40.3 36.4 39 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.