SLLSEE8B September   2013  – September 2014 SN65LVDS822

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (Continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Electrical Characteristics
    6. 7.6 Power Supply Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Test Patterns
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Unused LVDS Data Lanes
      2. 9.3.2 Tying CMOS Inputs With Resistors
    4. 9.4 Device Functional Modes
      1. 9.4.1 Active Modes
        1. 9.4.1.1 4-Lanes 7-Bit Mode
        2. 9.4.1.2 2-Lanes 14-Bit Mode
      2. 9.4.2 Low-Power Modes
        1. 9.4.2.1 Standby Mode
        2. 9.4.2.2 Shutdown Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Color Bit Mapping
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Power Supply
        2. 10.2.2.2 CMOS Output Bus Connector
        3. 10.2.2.3 Power-Up Sequence
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Decoupling Capacitor Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (October 2013) to B Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go