SCAS529F August 1995 – June 2025 SN54AC10 , SN74AC10
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
Figure 4-1 SN54AC10 J or W Package
(Top View)
Figure 4-2 SN54AC10 FK Package (Top
View)
Figure 4-4 SN74AC10 D, DB, N, NS, or
PW Package (Top View)| PIN | Type(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| 1A | 1 | I | Channel 1, Input A |
| 1B | 2 | I | Channel 1, Input B |
| 2A | 3 | I | Channel 2, Input A |
| 2B | 4 | I | Channel 2, Input B |
| 2C | 5 | I | Channel 2, Input C |
| 2Y | 6 | O | Channel 2, Output Y |
| GND | 7 | G | Ground |
| 3Y | 8 | O | Channel 3, Output Y |
| 3C | 9 | I | Channel 3, Input A |
| 3B | 10 | I | Channel 3, Input B |
| 3A | 11 | I | Channel 3, Input C |
| 1Y | 12 | O | Channel 1, Output Y |
| 1C | 13 | I | Channel 1, Input C |
| VCC | 14 | P | Positive Supply |
| Thermal pad(2) | — | The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply. | |