SCAS542H October 1995 – February 2024 SN74AC573
PRODMIX
Refer to the PDF data sheet for device specific package drawings
Figure 4-1 DB, DGV, DW, NS, N, or PW
Packages, 20-Pin SSOP, TVSOP, SOIC, SOP, PDIP, or TSSOP (Top View)
Figure 4-2 RKS Package, 20-Pin VQFN (Top View)| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| OE | 1 | I | Output enable |
| 1D | 2 | I | 1D input |
| 2D | 3 | I | 2D input |
| 3D | 4 | I | 3D input |
| 4D | 5 | I | 4D input |
| 5D | 6 | I | 5D input |
| 6D | 7 | I | 6D input |
| 7D | 8 | I | 7D input |
| 8D | 9 | I | 8D input |
| GND | 10 | — | Ground |
| LE | 11 | I | Latch enable input |
| 8Q | 12 | O | 8Q output |
| 7Q | 13 | O | 7Q output |
| 6Q | 14 | O | 6Q output |
| 5Q | 15 | O | 5Q output |
| 4Q | 16 | O | 4Q output |
| 3Q | 17 | O | 3Q output |
| 2Q | 18 | O | 2Q output |
| 1Q | 19 | O | 1Q output |
| VCC | 20 | — | Power pin |
| Thermal Pad(2) | — | The thermal pad can be connect to GND or left floating. Do not connect to any other signal or supply. | |