SCLS365K May   1996  – February 2024 SN74AHC132

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 5.7  Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 5.8  Noise Characteristics
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • DGV|14
  • PW|14
  • BQA|14
  • N|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) SN74AHC132 UNIT
BQA D DB DR N NS PW RGY
14 PINS
RθJA Junction-to-ambient thermal resistance 88.3 124.6 107.1 90.6 57.4 90.7 147.7 57.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 90.9 79.7 59.6 50.9 44.9 48.3 77.4 57.5
RθJB Junction-to-board thermal resistance 56.8 81.2 54.4 44.8 37.2 49.4 90.9 33.6
ψJT Junction-to-top characterization parameter 9.9 39.3 20.5 14.7 30.1 14.6 27.2 3.4
ψJB Junction-to-board characterization parameter 56.7 80.8 53.8 44.5 37.1 49.1 90.2 33.7
RθJC(bot) Junction-to-case (bottom) thermal resistance 33.4 N/A N/A N/A N/A N/A N/A 13.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).