SCLSA06 February   2024 SN74AHC157-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Noise Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Standard CMOS Inputs
      3. 7.3.3 Wettable Flanks
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20200826-CA0I-CXGT-1L37-WH3HNLC1BSRH-low.gifFigure 4-1 PW Package,16-Pin TSSOP(Top View)
GUID-20211215-SS0I-LC4Q-DDGG-5F5K8BNWXCHD-low.gifFigure 4-2 WBQB Package,16-Pin WQFN(Transparent Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A/B 1 I Address select
1A 2 I Channel 1, data input A
1B 3 I Channel 1, data input B
1Y 4 I Channel 1, data output
2A 5 O Channel 2, data input A
2B 6 O Channel 2, data input B
2Y 7 I Channel 2, data output
GND 8 G Ground
3Y 9 I Channel 3, data output
3B 10 I Channel 3, data input B
3A 11 I Channel 3, data input A
4Y 12 I Channel 4, data output
4B 13 I Channel 4, data input B
4A 14 I Channel 4, data input A
G 15 I Output strobe, active low
VCC 16 P Positive supply
Thermal pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output, P = Power, G = Ground.
(2) WBQB package only.