SGDS020D February   2002  – February 2024 SN74AHC74Q-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information — SN74AHC74Q-Q1
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements — VCC = 3.3 V ± 0.3 V
    7. 5.7  Timing Requirements — VCC = 5 V ± 0.5 V
    8. 5.8  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    9. 5.9  Switching Characteristics, VCC = 5 V ± 0.5 V
    10. 5.10 Noise Characteristics
    11. 5.11 Operating Characteristics
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Latching Logic
      3. 7.3.3 Standard CMOS Inputs
      4. 7.3.4 Wettable Flanks
      5. 7.3.5 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
        4. 8.2.1.4 Timing Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-71BCE299-810F-42D4-B8B0-FC16A45078A6-low.gifFigure 4-1 SN74AHC74Q-Q1 D or PW Package, 14-Pin SOIC or TSSOP (Top View)
GUID-20201105-CA0I-R51S-5DRT-TCZRPR5P0NLB-low.gifFigure 4-2 SN74AHC74Q-Q1 BQA Package, 14-Pin WQFN (Transparent Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1CLR 1 I Asynchronous clear for channel 1, active low
1D 2 I Data for channel 1
1CLK 3 I Clock for channel 1, rising edge triggered
1PRE 4 I Asynchronous preset for channel 1, active low
1Q 5 O Output for channel 1
1Q 6 O Inverted output for channel 1
GND 7 G Ground
2Q 8 O Inverted output for channel 2
2Q 9 O Output for channel 2
2PRE 10 I Asynchronous preset for channel 2, active low
2CLK 11 I Clock for channel 2, rising edge triggered
2D 12 I Data for channel 2
2CLR 13 I Asynchronous clear for channel 2, active low
VCC 14 P Positive supply
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) I = input, O = output, P = power, G = ground
(2) BQA package only