SCES530H December   2003  – December 2014 SN74AVC1T45

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics: VCCA = 1.2 V
    7. 7.7  Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    8. 7.8  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    9. 7.9  Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    10. 7.10 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    11. 7.11 Operating Characteristics
    12. 7.12 Typical Characteristics
      1. 7.12.1 Typical Propagation Delay (A to B) vs Load Capacitance
      2. 7.12.2 Typical Propagation Delay (A to B) vs Load Capacitance
      3. 7.12.3 Typical Propagation Delay (A to B) vs Load Capacitance
      4. 7.12.4 Typical Propagation Delay (A to B) vs Load Capacitance
      5. 7.12.5 Typical Propagation Delay (A to B) vs Load Capacitance
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully Configurable Dual-Rail Design Allows Each Port to Operate Over the Full 1.2-V to 3.6-V Power-Supply Range
      2. 9.3.2 Support High-Speed Translation
      3. 9.3.3 Ioff Supports Partial-Power-Down Mode Operation
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Enable Times
    2. 10.2 Typical Applications
      1. 10.2.1 Unidirectional Logic Level-Shifting Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Bidirectional Logic Level-Shifting Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Power-Up Considerations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • DRL|6
  • YZP|6
  • DCK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Trademarks

NanoFree is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.3 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.