SCDS143C October   2003  – June  2015 SN74CB3Q3125

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • RGY|14
  • DGV|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 4.6 V
VIN Control input voltage(2)(3) –0.5 7 V
VI/O Switch I/O voltage(2)(3)(4) –0.5 7 V
II/K Control input clamp current VIN < 0 –50 mA
II/OK I/O port clamp current VI/O < 0 –50 mA
IIO ON-state switch current(5) ±64 mA
Continuous current through VCC or GND ±100 mA
TJ Junction temperature 150 °C
Tstg Storage temperature –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O.
(5) II and IO are used to denote specific conditions for II/O.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) +2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) +1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 2.3 3.6 V
VIH High-level control input voltage VCC = 2.3 V to 2.7 V 1.7 5.5 V
VCC = 2.7 V to 3.6 V 2 5.5
VIL Low-level control input voltage VCC = 2.3 V to 2.7 V 0 0.7 V
VCC = 2.7 V to 3.6 V 0 0.8
VI/O Data input and output voltage 0 5.5 V
TA Operating free-air temperature –40 85 °C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

6.4 Thermal Information

THERMAL METRIC(1) SN74CB3Q3257 UNIT
DBQ (SSOP) DGV (TVSOP) PW (TSSOP) RGY (VQFN)
16 PINS 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 90 127 113 47 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VIK VCC = 3.6 V, II = –18 mA –1.8 V
IIN Control inputs VCC = 3.6 V, VIN = 0 to 5.5 V ±1 µA
IOZ(3) VCC = 3.6 V, VO = 0 to 5.5 V,
VI = 0,		 Switch OFF,
VIN = VCC or GND		 ±1 µA
Ioff VCC = 0, VO = 0 to 5.5 V, VI = 0 1 µA
ICC VCC = 3.6 V, II/O = 0,
Switch ON or OFF,		 VIN = VCC or GND 0.3 1 mA
ΔICC(4) Control inputs VCC = 3.6 V, One input at 3 V, Other inputs at VCC or GND 30 µA
ICCD(5) Per control
input		 VCC = 3.6 V, A and B ports open, 0.04 0.2 mA/
MHz
Control input switching at 50% duty cycle
Cin Control inputs VCC = 3.3 V, VIN = 5.5 V, 3.3 V, or 0 2.5 3.5 pF
Cio(OFF) VCC = 3.3 V, Switch OFF,
VIN = VCC or GND,		 VI/O = 5.5 V, 3.3 V, or 0 4 5 pF
Cio(ON) VCC = 3.3 V, Switch ON,
VIN = VCC or GND,		 VI/O = 5.5 V, 3.3 V, or 0 8 10 pF
ron(6) VCC = 2.3 V,
TYP at VCC = 2.5 V		 VI = 0, IO = 30 mA 4 8 Ω
VI = 1.7 V, IO = –15 mA 4 9
VCC = 3 V VI = 0, IO = 30 mA 4 6
VI = 2.4 V, IO = –15 mA 4 8
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(5) This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input (see Figure 2).
(6) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals.

6.6 Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V UNIT
MIN MAX MIN MAX
fOE(1) OE A or B 10 20 MHz
tpd(2) A or B B or A 0.12 0.2 ns
ten OE A or B 1.5 6.7 1.5 6.6 ns
tdis OE A or B 1 4.6 1 5.3 ns
(1) Maximum switching frequency for control input (VO > VCC, VI = 5 V, RL ≥ 1 MΩ, CL = 0)
(2) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).

6.7 Typical Characteristics

At TA = 25°C and VCC = 3.3 V, unless otherwise noted.
SN74CB3Q3125 D001_SCDS143.gif
IO = –15 mA
Figure 1. Typical On-State Resistance vs Input Voltage
SN74CB3Q3125 D002_SCDS143.gif
A and B Ports Open
Figure 2. Typical Supply Current vs OE Switching Frequency