SN74CB3Q3125

ACTIVE

Product details

Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 2.5, 3.3 Protocols Analog, JTAG, UART, I2C, SPI, RGMII, TDM, I2S Ron (Typ) (Ohms) 4 CON (Typ) (pF) 8 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 85 Features Powered-off protection, Supports input voltage beyond supply Input/output continuous current (Max) (mA) 64 Rating Catalog Supply current (Typ) (uA) 2000
Configuration 1:1 SPST Number of channels (#) 4 Power supply voltage - single (V) 2.5, 3.3 Protocols Analog, JTAG, UART, I2C, SPI, RGMII, TDM, I2S Ron (Typ) (Ohms) 4 CON (Typ) (pF) 8 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 500 Operating temperature range (C) -40 to 85 Features Powered-off protection, Supports input voltage beyond supply Input/output continuous current (Max) (mA) 64 Rating Catalog Supply current (Typ) (uA) 2000
SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 14 32 mm² 5 x 6.4 TVSOP (DGV) 14 23 mm² 3.6 x 6.4 VQFN (RGY) 14 12 mm² 3.5 x 3.5
  • High-Bandwidth Data Path (up to 500 MHz(1))
  • 5-V Tolerant I/Os With Device Powered Up
    or Powered Down
  • Low and Flat ON-State Resistance (ron)
    Characteristics Over Operating Range
    (ron = 3 Ω Typ)
  • Rail-to-Rail Switching on Data I/O Ports
    • 0-V to 5-V Switching With 3.3-V VCC
    • 0-V to 3.3-V Switching With 2.5-V VCC
  • Bidirectional Data Flow With Near-Zero
    Propagation Delay
  • Low Input and Output Capacitance Minimizes
    Loading and Signal Distortion
    (Cio(OFF) = 4 pF Typ)
  • Fast Switching Frequency (fOE = 20 MHz Max)
  • Data and Control Inputs Provide Undershoot
    Clamp Diodes
  • Low Power Consumption
    (ICC = 0.3 mA Typ)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0-V to 5-V Signaling Levels
    (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
  • Control Inputs Can Be Driven by TTL,
    5-V, or 3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications:
    USB Interface, Differential Signal Interface, Bus
    Isolation, Low-Distortion Signal Gating
  • High-Bandwidth Data Path (up to 500 MHz(1))
  • 5-V Tolerant I/Os With Device Powered Up
    or Powered Down
  • Low and Flat ON-State Resistance (ron)
    Characteristics Over Operating Range
    (ron = 3 Ω Typ)
  • Rail-to-Rail Switching on Data I/O Ports
    • 0-V to 5-V Switching With 3.3-V VCC
    • 0-V to 3.3-V Switching With 2.5-V VCC
  • Bidirectional Data Flow With Near-Zero
    Propagation Delay
  • Low Input and Output Capacitance Minimizes
    Loading and Signal Distortion
    (Cio(OFF) = 4 pF Typ)
  • Fast Switching Frequency (fOE = 20 MHz Max)
  • Data and Control Inputs Provide Undershoot
    Clamp Diodes
  • Low Power Consumption
    (ICC = 0.3 mA Typ)
  • VCC Operating Range From 2.3 V to 3.6 V
  • Data I/Os Support 0-V to 5-V Signaling Levels
    (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
  • Control Inputs Can Be Driven by TTL,
    5-V, or 3.3-V CMOS Outputs
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Supports Both Digital and Analog Applications:
    USB Interface, Differential Signal Interface, Bus
    Isolation, Low-Distortion Signal Gating

The SN74CB3Q3125 device is a high-bandwidth FET bus switch that uses a charge pump to elevate the gate voltage of the pass transistor, thus providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The SN74CB3Q3125 device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus.

The SN74CB3Q3125 device is a high-bandwidth FET bus switch that uses a charge pump to elevate the gate voltage of the pass transistor, thus providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The SN74CB3Q3125 device also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus.

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Technical documentation

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Type Title Date
* Data sheet SN74CB3Q3125 Quadruple FET Bus Switch 2.5-V/3.3-V Low-Voltage, High-Bandwidth Bus Switch datasheet (Rev. C) 29 Jun 2015
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. D) 09 Dec 2021
Application note Multiplexers and Signal Switches Glossary (Rev. B) 01 Dec 2021
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) 19 Nov 2021
Application note Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) 06 Jan 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Technical article Logic gates and switches with Ioff or powered-off protection: empowering you to power down 02 Nov 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
More literature Digital Bus Switch Selection Guide (Rev. A) 10 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
More literature Logic Cross-Reference (Rev. A) 07 Oct 2003
Application note Bus FET Switch Solutions for Live Insertion Applications 07 Feb 2003

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

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Simulation model

SN74CB3Q3125 IBIS Model (Rev. A)

SCDM067A.ZIP (25 KB) - IBIS Model
Simulation model

HSPICE MODEL OF SN74CB3Q3125

SCEJ199.ZIP (93 KB) - HSpice Model
Reference designs

TIDA-00180 — Power Supply with Programmable Output Voltage and Protection for Position Encoder Interfaces

This reference design implements a universal power supply with programmable output voltage and innovative smart eFuse technology for use in a multi-standard position encoder interface module on an industrial drive. The eFuse provides inrush-current and over-current protection as well as user (...)
Package Pins Download
SSOP (DBQ) 16 View options
TSSOP (PW) 14 View options
TVSOP (DGV) 14 View options
VQFN (RGY) 14 View options

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