SCLS305E January   1996  – May 2022 SN54HC541 , SN74HC541

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics, TA = 25°C
    6. 6.6  Electrical Characteristics, SN54HC541
    7. 6.7  Electrical Characteristics, SN74HC541
    8. 6.8  Switching Characteristics, CL = 50 pF, TA = 25°C
    9. 6.9  Switching Characteristics, CL = 50 pF, SN54HC541
    10. 6.10 Switching Characteristics, CL = 50 pF, SN74HC541
    11. 6.11 Switching Characteristics, CL = 150 pF, TA = 25°C
    12. 6.12 Switching Characteristics, CL = 150 pF, SN54HC541
    13. 6.13 Switching Characteristics, CL = 150 pF, SN74HC541
    14. 6.14 Operating Characteristics
    15. 6.15 Typical Characteristics
  7. 7 Parameter Measurement Information
    1.     24
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • N|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (September 2016) to Revision E (May 2022)

  • Updated ESD ratings table to include modern TI terminologyGo
  • Junction-to-ambient thermal resistance values increased. DB was 90.2 is now 122.7, DW was 77.5 is now 109.1, N was 45.2 is now 84.6, NS was 72.8 is now 113.4, PW was 98.3 is now 131.8Go

Changes from Revision C (August 2003) to Revision D (September 2016)

  • Added Applications section, Thermal Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Deleted Ordering Information table, see Mechanical, Packaging, and Orderable Information at the end of the datasheetGo
  • Changed RθJA for DB package from 70°C/W: to 90.2°C/WGo
  • Changed RθJA for DW package from 58°C/W: to 77.5°C/WGo
  • Changed RθJA for N package from 69°C/W: to 45.2°C/WGo
  • Changed RθJA for NS package from 60°C/W: to 72.8°C/WGo
  • Changed RθJA for PW package from 83°C/W: to 98.3°C/WGo