SCLS776C December   2019  – March 2026 SN74HCS02

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN74HCS02 D, DYY, or PW Package; 14-Pin SOIC or TSSOP Top ViewD, DYY, or PW Package;
14-Pin SOIC or TSSOP
Top View
SN74HCS02 BQA Package14-Pin WQFNTop ViewBQA Package
14-Pin WQFN
Top View
Table 4-1 Pin Functions
PIN I/O DESCRIPTION
NAME NO.
1A 2 Input Channel 1, Input A
1B 3 Input Channel 1, Input B
1Y 1 Output Channel 1, Output Y
2A 5 Input Channel 2, Input A
2B 6 Input Channel 2, Input B
2Y 4 Output Channel 2, Output Y
3A 8 Input Channel 3, Input A
3B 9 Input Channel 3, Input B
3Y 10 Output Channel 3, Output Y
4A 11 Input Channel 4, Input A
4B 12 Input Channel 4, Input B
4Y 13 Output Channel 4, Output Y
GND 7 — Ground
VCC 14 — Positive Supply
Thermal Pad(1) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply
(1) BQA Package only.