SCLS819B August   2020  – December 2021 SN74HCS151-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     4
    2.     5
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
      4. 8.3.4 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1.     Package Option Addendum
      1.      Tape and Reel Information
        1.       Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20200826-CA0I-JGGQ-1DWB-RCTFMHZPRHBH-low.gifD or PW Package
16-Pin SOIC or TSSOP
Top View
GUID-20210604-CA0I-QTWZ-GL9M-NRRCXP6P3DGG-low.gifWBQB Package
16-Pin WQFN
Top View
Pin Functions
PIN I/O(2) DESCRIPTION
SOIC or TSSOPor WBQB NO. NAME
1 D3 I Data input 3
2 D2 I Data input 2
3 D1 I Data input 1
4 D0 I Data input 0
5 Y O Data output
6 W O Data output, inverted
7 G I Output strobe, active low
8 GND — Ground
9 C I Address select C
10 B I Address select B
11 A I Address select A
12 D7 I Data input 7
13 D6 I Data input 6
14 D5 I Data input 5
15 D4 I Data input 4
16 VCC — Positive supply
Thermal Pad (1) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) WBQB package only.
(2) Signal Types: I = Input, O = Output, I/O = Input or Output.