SCLS816A September   2020  – December 2021 SN74HCS367-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
    1.     4
      1.      5
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS 3-State Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diode Structure
      4. 8.3.4 Wettable Flanks
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Power Considerations
        2. 9.2.1.2 Input Considerations
        3. 9.2.1.3 Output Considerations
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Overview

The SN74HCS367-Q1 contains 6 individual high speed CMOS buffers with Schmitt-trigger inputs and 3-state outputs.

Each buffer performs the boolean logic function xYn = xAn, with x being the bank number and n being the channel number.

The first bank includes four buffers, and the second bank includes two buffers.

Each output enable (xOE) controls one bank of buffers. When the xOE pin is in the low state, the outputs of all buffers in the bank x are enabled. When the xOE pin is in the high state, the outputs of all buffers in the bank x are disabled. All disabled output are placed into the high-impedance state.

To ensure the high-impedance state during power up or power down, both xOE pins should be tied to VCC through a pull-up resistor. The value of the resistor is determined by the current sinking capability of the driver and the leakage of the pin as defined in the Electrical Characteristics table. Typically a 10 kΩ resistor will be sufficient.