SCLS838A October   2020  – October 2026 SN74HCS367

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS 3-State Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
      4. 7.3.4 Wettable Flanks
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

SN74HCS367 D or PW Package20-Pin SOIC or TSSOPTop ViewFigure 4-1 D or PW Package
20-Pin SOIC or TSSOP
Top View
SN74HCS367 WBQB Package20-Pin WQFNTop ViewFigure 4-2 WBQB Package
20-Pin WQFN
Top View
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
SOIC or TSSOP NO. NAME
1 1OE I Bank 1, output enable, active low
2 1A1 I Bank 1, channel 1 input
3 1Y1 O Bank 1, channel 1 output
4 1A2 I Bank 1, channel 2 input
5 1Y2 O Bank 1, channel 2 output
6 1A3 I Bank 1, channel 3 input
7 1Y3 O Bank 1, channel 3 output
8 GND — Ground
9 1Y4 O Bank 1, channel 4 output
10 1A4 I Bank 1, channel 4 input
11 2Y1 O Bank 2, channel 1 output
12 2A1 I Bank 2, channel 1 input
13 2Y2 O Bank 2, channel 2 output
14 2A2 I Bank 2, channel 2 input
15 2OE I Bank 2, output enable, active low
16 VCC — Positive supply
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output.
(2) WBQB package only.