SCLS177H March   1984  – August 2024 SN74HCT574

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Timing Requirements
    6. 4.6 Switching Characteristics, CL = 50 pF
    7. 4.7 Switching Characteristics, CL = 150 pF
    8. 4.8 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • N|20
  • DGS|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision G (July 2022) to Revision H (August 2024)

  • Added DGS package to Device Information table, Pin Configuration and Functions section, and Thermal Information tableGo
  • Added package size to Device Information tableGo
  • Added Application and Implementation sectionGo

Changes from Revision F (January 2022) to Revision G (July 2022)

  • Junction-to-ambient thermal resistance values increased. DW was 58 is now 109.1, DB was 70 is now 122.7, N was 69 is now 84.6, NS was 60 is now 113.4, PW was 83 is now 131.8Go