SCLS903 May   2022 SN74LV1T34-Q1

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics – 1.8-V VCC
    7. 6.7  Switching Characteristics – 2.5-V VCC
    8. 6.8  Switching Characteristics – 3.3-V VCC
    9. 6.9  Switching Characteristics – 5.0-V VCC
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Clamp Diode Structure
      3. 8.3.3 LVxT Enhanced Input Voltage
        1. 8.3.3.1 Down Translation
        2. 8.3.3.2 Up Translation
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Design Requirements
      1. 9.3.1 Power Considerations
      2. 9.3.2 Input Considerations
      3. 9.3.3 Output Considerations
    4. 9.4 Detailed Design Procedure
    5. 9.5 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • AEC-Q100 qualified for automotive applications:

    • Device temperature grade 1: -40°C to +125°C

    • Device HBM ESD classification level 2

    • Device CDM ESD classifcation level C4B

  • Wide operating range of 1.8 V to 5.5 V

  • Single-supply voltage translator (refer to LVxT Enhanced Input Voltage):

    • Up translation:

      • 1.2 V to 1.8 V

      • 1.5 V to 2.5 V

      • 1.8 V to 3.3 V

      • 3.3 V to 5.0 V

    • Down translation:

      • 5.0 V, 3.3 V, 2.5 V to 1.8 V
      • 5.0 V, 3.3 V to 2.5 V
      • 5.0 V to 3.3 V
  • 5.5 V tolerant input pins
  • Supports standard pinouts
  • Up to 150 Mbps with 5 V or 3.3 V VCC
  • Latch-up performance exceeds 250 mA per
    JESD 17