SCAS595W October   1997  – October 2016 SN74LVC07A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics—DC Limit Changes
    6. 6.6 Switching Characteristics
    7. 6.7 Operating Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 VCC = 1.8 V ± 0.15 V
    2. 7.2 VCC = 2.5 V ± 0.2 V
    3. 7.3 VCC = 2.7 and 3.3 V ± 0.3 V
    4. 7.4 VCC = 5 V ± 0.5 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • RGY|14
  • DB|14
  • DGV|14
  • PW|14
  • NS|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 6.5 V
VI Input voltage(2) –0.5 6.5 V
VO Output voltage –0.5 6.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
Tj Junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage 1.65 5.5 V
VIH High-level input voltage VCC = 1.65 V to 1.95 V 0.65 × VCC V
VCC = 2.3 V to 2.7 V 1.7
VCC = 2.7 V to 3.6 V 2
VCC = 4.5 V to 5.5 V 0.7 × VCC
VIL Low-level input voltage VCC = 1.65 V to 1.95 V 0.35 × VCC V
VCC = 2.3 V to 2.7 V 0.7
VCC = 2.7 V to 3.6 V 0.8
VCC = 4.5 V to 5.5 V 0.3 × VCC
VI Input voltage 0 5.5 V
VO Output voltage 0 5.5 V
IOL Low-level output current VCC = 1.65 V 4 mA
VCC = 2.3 V 12
VCC = 2.7 V 12
VCC = 3 V 24
VCC = 4.5 V 24
TA Operating free-air temperature –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

THERMAL METRIC(1) SN74LVC07A UNIT
D
(SOIC)		 DB
(SSOP)		 DGV
(TVSOP)		 NS
(SO)		 PW
(TSSOP)		 RGY
(VQFN)
14 PINS
RθJA Junction-to-ambient thermal resistance 177.4 135.1 157.7 120.3 160.3 80.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75.4 86.7 78.3 76.3 84.4 97.0 °C/W
RθJB Junction-to-board thermal resistance 70.6 82.4 90.8 79.0 102.1 56.7 °C/W
ψJT Junction-to-top characterization parameter 34.7 43.7 21.0 36.2 24.3 16.7 °C/W
ψJB Junction-to-board characterization parameter 70.4 81.9 90.1 78.7 101.4 56.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a 35.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics—DC Limit Changes

TA = –40°C to +125°C, unless otherwise noted
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
VOL IOL = 100 µA 1.65 V to 5.5 V 0.2 V
IOL = 4 mA 1.65 V 0.45
IOL = 12 mA 2.3 V 0.7
2.7 V 0.4
IOL = 24 mA 3 V 0.55
II VI = 5.5 V or GND 3.6 V ±5 µA
Ioff VI or VO = 5.5 V 0 V ±10 µA
ICC VI = VCC or GND, IO = 0 3.6 V 10 µA
ΔICC One input at VCC  – 0.6 V,
Other inputs at VCC or GND		 2.7 V to 3.6 V 500 µA
Ci VI = VCC or GND 3.3 V 5.0 pF
(1) All typical values are at VCC = 3.3 V, TA = 25°C.

6.6 Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3 through Figure 6)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 TEST CONDITIONS MIN MAX UNIT
tpd A Y –40°C to 85°C VCC = 1.8 V ± 0.15 V 1 5.6 ns
VCC = 2.5 V ± 0.2 V 1 3.4
VCC = 2.7 V 1 3.3
VCC = 3.3 V ± 0.3 V 1 3.6
VCC = 5 V ± 0.5 V 1 2.6
–40°C to 125°C VCC = 1.8 V ± 0.15 V 1 6.1
VCC = 2.5 V ± 0.2 V 1 3.9
VCC = 2.7 V 1 3.8
VCC = 3.3 V ± 0.3 V 1 4.1
VCC = 5 V ± 0.5 V 1 3.1

6.7 Operating Characteristics

TA = 25°C
PARAMETER TEST
CONDITIONS		 VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V UNIT
TYP TYP TYP TYP
Cpd Power dissipation capacitance
per buffer and driver		 f = 10 MHz 1.8 2 2.5 3.78 pF

6.8 Typical Characteristics

SN74LVC07A D001_SCAS595 (2).gif
Figure 1. TPD vs VCC
SN74LVC07A D002_SCAS595.gif
Figure 2. TPD vs Temperature