SCES487H September   2003  – November 2016 SN74LVC1G11

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 15 pF, TA = -40°C to +85°C
    7. 6.7  Switching Characteristics, CL = 30 pF or 50 pF, TA = -40°C to +85°C
    8. 6.8  Switching Characteristics, CL = 30 pF or 50 pF, TA = -40°C to +125°C
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • DSF|6
  • YZP|6
  • DCK|6
  • DRY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Validate and test the design implementation to confirm system functionality.

9.1 Application Information

The SN74LVC1G11 device offers logical AND configuration for many design applications. This example describes basic power sequencing using the AND gate configuration. Power sequencing is often used in applications that require a processor or other delicate device with specific voltage timing requirements in order to protect the device from malfunctioning. In the application below, the power-good signals from the supplies tell the MCU to continue an operation.

9.2 Typical Application

SN74LVC1G11 lvc1g11_sch.gif Figure 5. Typical Application Diagram

9.2.1 Design Requirements

  • Recommended input conditions:
  • Recommended output conditions:
    • Load currents must not exceed ±50 mA.
  • Frequency selection criterion:
    • Figure 6 illustrates the effects of frequency on output current.
    • Added trace resistance and capacitance can reduce maximum frequency capability. Follow the layout practices listed in the Layout section.

9.2.2 Detailed Design Procedure

The SN74LVC1G11 device uses CMOS technology and has balanced output drive. Avoid bus contentions that can drive currents that can exceed maximum limits.

The SN74LVC1G11 allows for performing the logical AND function with digital signals. Maintain input signals as close as possible to either 0 V or VCC for optimal operation.

9.2.3 Application Curve

SN74LVC1G11 sces416_appcurve1.png
VCC = 5 V
Figure 6. Simulated Input-to-Output Voltage Response Showing Propagation Delay