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SN74LVC1G11

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Single 3-Input Positive-AND Gate

Data sheet
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Single 3-Input Positive-AND Gate

SN74LVC1G11

ACTIVE
Data sheet Order now

Product details

Parameters

Technology Family LVC VCC (Min) (V) 1.65 VCC (Max) (V) 5.5 Channels (#) 1 Inputs per channel 3 IOL (Max) (mA) 32 IOH (Max) (mA) -32 Input type Standard CMOS Output type Push-Pull Features Partial Power Down (Ioff), Over-Voltage Tolerant Inputs, Ultra High Speed (tpd <5ns) Data rate (Max) (Mbps) 100 Rating Catalog Operating temperature range (C) -40 to 125, -40 to 85 open-in-new Find other AND gate

Package | Pins | Size

DSBGA (YZP) 6 2 mm² .928 x 1.428 SOT-23 (DBV) 6 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 6 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DSF) 6 1 mm² 1 x 1 open-in-new Find other AND gate

Features

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoFree™ Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Maximum tpd of 4.1 ns at 3.3 V
  • Low Power Consumption, 10-µA Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Partial-Power-Down Mode Operation
 open-in-new Find other AND gate

Description

The SN74LVC1G11 performs the Boolean function Y = A • B • C or Y = A\ + B\ + C\ in positive logic.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

 open-in-new Find other AND gate
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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SN74LVC1G11 Single 3-Input Positive-AND Gate datasheet (Rev. H) Nov. 10, 2016
Technical articles How to keep your motor running safely Jun. 04, 2020
Selection guide Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note How to Select Little Logic (Rev. A) Jul. 26, 2016
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guide Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application note Texas Instruments Little Logic Application Report Nov. 01, 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application note LVC Characterization Information Dec. 01, 1996
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
User guide Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
View details
EVALUATION BOARD Download
Description

The DM38x Camera Starter Kit (CSK) enables developers to begin designing wireless or wired connected digital video applications, such as security cameras, car DVRs, endoscopes, action-wearable cameras, drones, video doorbells, baby monitors, and other connected video products.

The DM38x (...)

Features
  • TMDSCSK388: 60-mm x 44-mm DM388 processor board
  • TMDSCSKCC: 90-mm x 90-mm I/O common carrier board
  • Integrated WiLink 8 single-band combo 2 x 2 MIMO WiFi, Bluetooth, and Bluetooth Smart (low energy) module
  • IPNC SDK with Linux 4.4 LTS kernel preloaded on included SD card enables fast application (...)
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EVALUATION BOARD Download
Description

The TMS320DM8127 Camera Starter Kit (CSK) enables developers to begin designing wireless or wired connected digital video applications, such as security cameras, car DVRs, action-wearable cameras, drones, video conferencing, digital signage, stereo camera and other connected video products. The (...)

Features
  • TMDSCSK8127: 60-mm x 44-mm TMS320DM8127 processor board
  • TMDSCSKCC: 90-mm x 90-mm I/O common carrier board
  • Integrated WiLink 8 single-band combo 2 x 2 MIMO WiFi, Bluetooth, and Bluetooth Smart (low energy) module
  • IPNC SDK with Linux 4.4 LTS kernel preloaded on included SD card enables fast application (...)
View details
DEVELOPMENT KIT Download
699
Description

The K2G Evaluation Module (EVM) enables developers to immediately start evaluating the 66AK2Gx - 600MHz processor, and to accelerate the development of audio, industrial motor control, smart grid protection and other high reliability, real-time compute intensive applications.  Similar to (...)

Features
  • 66AK2G02 C66x DSP+ARM A15 Processor at 600MHz
  • 2-GByte DDR3L with ECC
  • TPS659118 PMIC
  • Audio and Serial expansion headers
  • Processor SDK Linux and TI-RTOS support
  • Supports Gigabit Ethernet
View details
DEVELOPMENT KIT Download
699
Description

The EVMK2GX (also known as "K2G") 1GHz evaluation module (EVM) enables developers to immediately start evaluating the 66AK2Gx processor family, and to accelerate the development of audio, industrial motor control, smart grid protection and other high reliability, real-time compute intensive (...)

Features
  • 66AK2G12 C66x DSP+Arm Cortex-A15 processor at 1GHz
  • 2-GByte DDR3L with ECC
  • TPS65911A PMIC
  • Audio and serial expansion headers
  • Processor SDK Linux and TI-RTOS support
View details
DEVELOPMENT KIT Download
1049
Description

The K2G 1GHz High Secure Evaluation Module (EVM) enables developers to start  evaluating and testing the programming of the  high secure developmental version of the  66AK2Gx processor, and to accelerate the next stage of secure boot product development of audio and industrial real (...)

Features
  • 66AK2G12 C66x DSP+ARM A15 Processor at 1GHz
  • 2-GByte DDR3L with ECC
  • TPS65911A PMIC
  • Audio and serial expansion headers
  • Processor SDK Linux and TI-RTOS support
View details

Design tools & simulation

SIMULATION MODEL Download
SCEM369A.ZIP (44 KB) - IBIS Model
SIMULATION MODEL Download
SCEM640.ZIP (8 KB) - PSpice Model

Reference designs

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TIDA-010057 — Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data (...)
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TIDA-01455 — The TIDA-01455 is a reinforced isolated, in-line, shunt-based, precision-phase current sensing reference design for three-phase inverters. One of the challenges with GaN or SiC inverters at high PWM switching is accurate phase current sensing across the shunt in presence of noise due to the high PWM (...)
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REFERENCE DESIGNS Download
Three-phase, 1.25-kW, 200-VAC small form factor GaN inverter reference design for integrated drives
TIDA-00915 — This reference design is a three-phase inverter with a continuous power rating of 1.25 kW at 50°C ambient and 550 W at 85°C ambient for driving 200-V AC servo motors. It features 600-V LMG3411R150 Gallium Nitride (GaN) power modules with an integrated FET and gate driver mounted on an (...)
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REFERENCE DESIGNS Download
Reference design for reinforced isolation 3-phase inverter with current, voltage and temp protection
TIDA-00366 — This design provides a reference solution for a three-phase inverter rated up to 10kW, designed using the reinforced isolated gate driver UCC21530, reinforced isolated amplifiers AMC1301 and AMC1311, and MCU TMS320F28027. Lower system cost is achieved by using the AMC1301 to measure motor current (...)
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TUV-assessed digital input reference design for IEC 61508 (SIL-2)
TIDA-010049 — This 8-channel, group-isolated, digital input module reference design, focuses on applications with the need for industrial functional safety. This design has diagnostics implemented to help detect both permanent and transient random hardware faults. The concept of this input module has been (...)
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3D Machine Vision Reference Design Based on AM572x Processor with DLP® Structured Light
TIDEP0076 — The TIDEP0076 3D machine vision design describes an embedded 3D scanner based on the structured light principle. A digital camera along with a Sitara™ AM57xx processor System on Chip (SoC)  is used to capture reflected light patterns from a DLP4500-based projector. Subsquent processing of (...)
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Monte-Carlo Simulation on AM57x Using OpenCL for DSP Acceleration Reference Design
TIDEP0046 — TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy (...)
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REFERENCE DESIGNS Download
Power and Thermal Design Considerations Using TI's AM57x Processor Reference Design
TIDEP0047 — This TI Design (TIDEP0047) is a reference platform based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC).  This TI Design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and (...)
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CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 6 View options
SC70 (DCK) 6 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 6 View options

Ordering & quality

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  • Ongoing reliability monitoring

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