Single 3-input, 1.65-V to 5.5-V AND gate
Product details
Parameters
Package | Pins | Size
Features
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 1000-V Charged-Device Model (C101)
- Available in the Texas Instruments NanoFree™ Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Maximum tpd of 4.1 ns at 3.3 V
- Low Power Consumption, 10-µA Maximum ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Partial-Power-Down Mode Operation
Description
The SN74LVC1G11 performs the Boolean function Y = A B C or Y = A\ + B\ + C\ in positive logic.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Description
The DM38x Camera Starter Kit (CSK) enables developers to begin designing wireless or wired connected digital video applications, such as security cameras, car DVRs, endoscopes, action-wearable cameras, drones, video doorbells, baby monitors, and other connected video products.
The DM38x (...)
Features
- TMDSCSK388: 60-mm x 44-mm DM388 processor board
- TMDSCSKCC: 90-mm x 90-mm I/O common carrier board
- Integrated WiLink 8 single-band combo 2 x 2 MIMO WiFi, Bluetooth, and Bluetooth Smart (low energy) module
- IPNC SDK with Linux 4.4 LTS kernel preloaded on included SD card enables fast application (...)
Description
The TMS320DM8127 Camera Starter Kit (CSK) enables developers to begin designing wireless or wired connected digital video applications, such as security cameras, car DVRs, action-wearable cameras, drones, video conferencing, digital signage, stereo camera and other connected video products. The (...)
Features
- TMDSCSK8127: 60-mm x 44-mm TMS320DM8127 processor board
- TMDSCSKCC: 90-mm x 90-mm I/O common carrier board
- Integrated WiLink 8 single-band combo 2 x 2 MIMO WiFi, Bluetooth, and Bluetooth Smart (low energy) module
- IPNC SDK with Linux 4.4 LTS kernel preloaded on included SD card enables fast application (...)
Description
The K2G Evaluation Module (EVM) enables developers to immediately start evaluating the 66AK2Gx - 600MHz processor, and to accelerate the development of audio, industrial motor control, smart grid protection and other high reliability, real-time compute intensive applications. Similar to (...)
Features
- 66AK2G02 C66x DSP+ARM A15 Processor at 600MHz
- 2-GByte DDR3L with ECC
- TPS659118 PMIC
- Audio and Serial expansion headers
- Processor SDK Linux and TI-RTOS support
- Supports Gigabit Ethernet
Description
The EVMK2GX (also known as "K2G") 1GHz evaluation module (EVM) enables developers to immediately start evaluating the 66AK2Gx processor family, and to accelerate the development of audio, industrial motor control, smart grid protection and other high reliability, real-time compute intensive (...)
Features
- 66AK2G12 C66x DSP+Arm Cortex-A15 processor at 1GHz
- 2-GByte DDR3L with ECC
- TPS65911A PMIC
- Audio and serial expansion headers
- Processor SDK Linux and TI-RTOS support
Description
The K2G 1GHz High Secure Evaluation Module (EVM) enables developers to start evaluating and testing the programming of the high secure developmental version of the 66AK2Gx processor, and to accelerate the next stage of secure boot product development of audio and industrial real (...)
Features
- 66AK2G12 C66x DSP+ARM A15 Processor at 1GHz
- 2-GByte DDR3L with ECC
- TPS65911A PMIC
- Audio and serial expansion headers
- Processor SDK Linux and TI-RTOS support
Design tools & simulation
Reference designs
Design files
-
download TIDA-010057 BOM.pdf (157KB) -
download TIDA-010057 Assembly Drawing.pdf (285KB) -
download TIDA-010057 PCB.pdf (3590KB) -
download TIDA-010057 Gerber.zip (3652KB) -
download TIDA-010057 CAD Files (Rev. A).zip (6926KB)
Design files
Design files
-
download TIDA-00366 Assembly Drawing (Rev. B).pdf (906KB) -
download TIDA-00366 BOM (Rev. B).pdf (105KB) -
download TIDA-00366 Altium (Rev. B).zip (2891KB) -
download TIDA-00366 Gerber (Rev. B).zip (586KB) -
download TIDA-00366 PCB (Rev. B).pdf (3165KB)
Design files
-
download TIDA-010049 BOM.pdf (49KB) -
download TIDA-010049 Assembly Drawing.pdf (510KB) -
download TIDA-010049 PCB.pdf (2566KB) -
download TIDA-010049 CAD Files.zip (2441KB) -
download TIDA-010049 Gerber.zip (589KB)
Design files
Design files
Design files
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YZP) | 6 | View options |
SC70 (DCK) | 6 | View options |
SON (DRY) | 6 | View options |
SON (DSF) | 6 | View options |
SOT-23 (DBV) | 6 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
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