SCES414P November   2002  – November 2016 SN74LVC1G57

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Schmitt-Trigger Inputs
      2. 8.3.2 Inputs Accept Voltages to 5.5 V
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Application Truth Table
        2. 9.2.1.2 Schmitt-Trigger Inputs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, VCC –0.5 6.5 V
Input voltage, VI(2) –0.5 6.5 V
Voltage range (applied to any output), VO High-impedance or power-off state(2) –0.5 6.5 V
High or low state(2)(3) –0.5 VCC + 0.5
Input clamp current, IIK (VI < 0) –50 mA
Output clamp current, IOK (VO < 0) –50 mA
Continuous output current, IO ±50 mA
Continuous current through VCC or GND ±100 mA
Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the Recommended Operating Conditions table.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage Operating 1.65 5.5 V
Data retention only 1.5
VI Input voltage 0 5.5 V
VO Output voltage 0 VCC V
IOH High-level output current VCC = 1.65 V –4 mA
VCC = 2.3 V –8
VCC = 3 V –16
–24
VCC = 4.5 V –32
IOL Low-level output current VCC = 1.65 V 4 mA
VCC = 2.3 V 8
VCC = 3 V 16
24
VCC = 4.5 V 32
TA Operating free-air temperature BGA package –40 85 °C
All other packages –40 125
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation, see Implications of Slow or Floating CMOS Inputs (SCBA004).

6.4 Thermal Information

THERMAL METRIC(1) SN74LVC1G57 UNIT
DBV (SOT) DCK (SOT) DRL (SOT) YZP (DSGBA) DSF (SON) DRY (SON)
6 PINS 6 PINS 6 PINS 6 PINS 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 223 271.7 252.5 124 360.1 332.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 174.4 129.8 111.6 1.4 158.8 198.5 °C/W
RθJB Junction-to-board thermal resistance 71 73.1 118.5 29.7 213.5 189 °C/W
ψJT Junction-to-top characterization parameter 57.1 8.3 11.8 0.5 20.4 44.3 °C/W
ψJB Junction-to-board characterization parameter 70.3 72.4 118.8 30.1 213.2 189.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VT+ Positive-going input threshold voltage VCC = 1.65 V 0.79 1.16 V
VCC = 2.3 V 1.11 1.56
VCC = 3 V 1.5 1.87
VCC = 4.5 V 2.16 2.74
VCC = 5.5 V 2.61 3.33
VT– Negative-going input threshold voltage VCC = 1.65 V 0.35 0.62 V
VCC = 2.3 V 0.58 0.87
VCC = 3 V 0.84 1.19
VCC = 4.5 V 1.41 1.9
VCC = 5.5 V 1.87 2.29
ΔVT Hysteresis (VT+ – VT–) VCC = 1.65 V 0.3 0.62 V
VCC = 2.3 V 0.4 0.8
VCC = 3 V 0.53 0.87
VCC = 4.5 V 0.71 1.04
VCC = 5.5 V 0.71 1.11
VOH VCC = 1.65 V to 5.5 V, IOH = –100 µA VCC – 0.1 V
VCC = 1.65 V, IOH = –4 mA 1.2
VCC = 2.3 V, IOH = –8 mA 1.9
VCC = 3 V, IOH = –16 mA 2.4
VCC = 3 V, IOH = –24 mA 2.3
VCC = 4.5 V, IOH = –32 mA 3.8
VOL VCC = 1.65 V to 5.5 V, IOL = 100 µA 0.1 V
VCC = 1.65 V, IOL = 4 mA 0.45
VCC = 2.3 V, IOL = 8 mA 0.3
VCC = 3 V, IOL = 16 mA TA = –40°C to 85°C 0.4
TA = –40°C to 125°C 0.45
VCC = 3 V, IOL = 24 mA 0.55
VCC = 4.5 V, IOL = 32 mA TA = –40°C to 85°C 0.55
TA = –40°C to 125°C 0.58
II VCC = 0 V to 5.5 V, VI = 5.5 V or GND ±1 µA
Ioff VCC = 0 V, VI or VO = 5.5 V ±10 µA
ICC VCC = 1.65 V to 5.5 V, VI = 5.5 V or GND, IO = 0 10 µA
ΔICC VCC = 3 V to 5.5 V, one input at VCC – 0.6 V,
other inputs at VCC or GND		 500 µA
Ci VCC = 3.3 V, VI = VCC or GND 3.5 pF
Cpd Power dissipation capacitance f = 10 MHz, TA = 25°C VCC = 1.8 V 20 pF
VCC = 2.5 V 20
VCC = 3.3 V 21
VCC = 5 V 22
(1) All typical values are at VCC = 3.3 V, TA = 25°C

6.6 Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted; see Figure 3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tpd Any input to Y (output) TA = –40°C to 85°C VCC = 1.8 V ± 0.15 V 3.2 14.4 ns
VCC = 2.5 V ± 0.2 V 2 8.3
VCC = 3.3 V ± 0.3 V 1.5 6.3
VCC = 5 V ± 0.5 V 1.1 5.1
TA = –40°C to 125°C VCC = 1.8 V ± 0.15 V 3.2 16.4
VCC = 2.5 V ± 0.2 V 2 9.3
VCC = 3.3 V ± 0.3 V 1.5 7.3
VCC = 5 V ± 0.5 V 1.1 6.1

6.7 Typical Characteristics

SN74LVC1G57 D001_VINvsIOFF.gif Figure 1. Partial-Power-Down Mode IOFF Across VIN
SN74LVC1G57 D002_VohVSIoh.gif Figure 2. Output Voltage (VOH) vs Current (IOH)