Configurable Multiple-Function Gate
Product details
Parameters
Package | Pins | Size
Features
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Supports Down Translation to VCC
- Max tpd of 6.3 ns at 3.3 V
- Schmitt-Triggered Inputs
- Low Power Consumption, 10-µA Maximum ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- Available in the Texas Instruments NanoFree™ Package
Description
The SN74LVC1G57 device features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and buffer. All inputs can be connected to VCC or GND.
This device functions as an independent gate, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.
This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Design tools & simulation
Reference designs
Design files
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download Data Concentrator for Smaller AMI Networks Reduces Infrastructure Cost BOM.pdf (163KB) -
download Data Concentrator for Smaller AMI Networks Reduces Infrastructure Assembly Files.zip (1250KB) -
download Data Concentrator Smaller AMI Networks Reduces Infrastructure Costs Layer Plots.zip (1115KB) -
download Data Concentrator for Smaller AMI Networks Reduces Infrastructure Cost CAD Files.zip (356KB) -
download Data Concentrator for Smaller AMI Networks Reduces Infrastructure Cost Gerber.zip (939KB)
Design files
-
download TIDA-00826 Gerber.zip (1121KB) -
download TIDA-00826 BOM.pdf (283KB) -
download TIDA-00826 PCB.pdf (28400KB)
Design files
-
download TIDA-00225 BOM.pdf (83KB) -
download TIDA-00225 PCB.zip (455KB) -
download TIDA-00225 CAD Files.zip (236KB) -
download TIDA-00225 Gerber.zip (661KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YZP) | 6 | View options |
SC70 (DCK) | 6 | View options |
SON (DRY) | 6 | View options |
SON (DSF) | 6 | View options |
SOT-23 (DBV) | 6 | View options |
SOT-5X3 (DRL) | 6 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
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