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Product details

Parameters

Technology Family LVC VCC (Min) (V) 1.65 VCC (Max) (V) 5.5 Channels (#) 1 Inputs per channel 1 IOL (Max) (mA) 32 IOH (Max) (mA) -32 Input type Schmitt-trigger Output type Push-Pull Features Partial Power Down (Ioff), Over-Voltage Tolerant Inputs, Very High Speed (tpd 5-10ns) Data rate (Max) (Mbps) 100 Rating Catalog Operating temperature range (C) -40 to 125, -40 to 85 open-in-new Find other Configurable gate

Package | Pins | Size

DSBGA (YZP) 6 2 mm² .928 x 1.428 SOT-23 (DBV) 6 5 mm² 2.9 x 1.6 SOT-5X3 (DRL) 6 2 mm² 1.65 x 1.2 SOT-SC70 (DCK) 6 4 mm² 2 x 2.1 USON (DRY) 6 1 mm² 1.5 x 1 X2SON (DSF) 6 1 mm² 1 x 1 open-in-new Find other Configurable gate

Features

  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
    • Supports Down Translation to VCC
  • Max tpd of 6.3 ns at 3.3 V
  • Schmitt-Triggered Inputs
  • Low Power Consumption, 10-µA Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Available in the Texas Instruments NanoFree™ Package
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Description

The SN74LVC1G57 device features configurable multiple functions. The output state is determined by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and buffer. All inputs can be connected to VCC or GND.

This device functions as an independent gate, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

This configurable multiple-function gate is designed for 1.65-V to 5.5-V VCC operation.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet SN74LVC1G57 Configurable Multiple-Function Gate datasheet (Rev. P) Nov. 29, 2016
Technical articles How to keep your motor running safely Jun. 04, 2020
Selection guides Little Logic Guide 2018 (Rev. G) Jul. 06, 2018
Selection guides Logic Guide (Rev. AB) Jun. 12, 2017
Application notes How to Select Little Logic (Rev. A) Jul. 26, 2016
Application notes Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application notes Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
Application notes Understanding Schmitt Triggers Sep. 21, 2011
User guides LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
More literature Design Summary for WCSP Little Logic (Rev. B) Nov. 04, 2004
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application notes Selecting the Right Level Translation Solution (Rev. A) Jun. 22, 2004
User guides Signal Switch Data Book (Rev. A) Nov. 14, 2003
Application notes Use of the CMOS Unbuffered Inverter in Oscillator Circuits Nov. 06, 2003
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
User guides LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) Dec. 18, 2002
Application notes Texas Instruments Little Logic Application Report Nov. 01, 2002
Application notes TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards Jun. 13, 2002
Application notes 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application notes Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS Mar. 27, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Application notes Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices Dec. 01, 1997
Application notes Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application notes CMOS Power Consumption and CPD Calculation (Rev. B) Jun. 01, 1997
Application notes LVC Characterization Information Dec. 01, 1996
Application notes Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application notes Live Insertion Oct. 01, 1996
User guides Low-Voltage Logic (LVC) Designer's Guide Sep. 01, 1996
Application notes Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
10
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices

Design tools & simulation

SIMULATION MODELS Download
SCEM292A.ZIP (44 KB) - IBIS Model

Reference designs

REFERENCE DESIGNS Download
Data Concentrator Reference Design for Smaller AMI Networks Reduces Infrastructure Cost
TIDM-MINI-DC — The TIDM-MINI-DC reference design implements a light-weight powerline communication (PLC) data concentrator (DC) solution integrated with an Ethernet repeater feature. A power grid network is static, which means that once end-nodes are installed the number of nodes to be supported by a DC is fixed (...)
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
50-Ohm 2-GHz Oscilloscope Front-end Reference Design
TIDA-00826 This reference design is part of an analog front-end for 50Ω-input oscilloscope application. System designers can readily use this evaluation platform to process input signals from DC to 2 GHz in both frequency-domain and time-domain applications.
document-generic Schematic document-generic User guide
REFERENCE DESIGNS Download
Data Concentrator Cape for BeagleBone Black
TIDA-00225 This design provides new connectivity options for developers working with the BeagleBone Black platform. It allows developers to work with TI’s Power Line Communications (PLC) and Radio Frequency modules to easily and quickly develop host applications for smart grid networks. Developers can (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 6 View options
SC70 (DCK) 6 View options
SON (DRY) 6 View options
SON (DSF) 6 View options
SOT-23 (DBV) 6 View options
SOT-5X3 (DRL) 6 View options

Ordering & quality

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