SCES323Q June   2001  – March 2017 SN74LVC1G66

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Analog Switch Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DSF|6
  • DCK|5
  • DRL|5
  • DRY|6
  • YZP|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Description

Overview

This single analog switch is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G66 device can handle analog and digital signals. The device permits bidirectional transmission of signals with amplitudes of up to 5.5 V (peak). Like all analog switches, the SN74LVC1G66 is bidirectional.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Functional Block Diagram

SN74LVC1G66 ld_ces323.gif Figure 10. Logic Diagram (Positive Logic)

Feature Description

The TI NanoFree package is one of TI’s smallest packages and allows customers to save board space while the solder bumps allow for easy testing. The SN74LVC1G66 has a wide VCC range, allowing rail-to-rail operation of signals anywhere from a 1.8-V system to a 5-V system. In addition, the control input (C Pin) is 5.5-V tolerant, allowing higher-voltage logic to interface to the switch control system.

Device Functional Modes

Table 1. Function Table

CONTROL INPUT (C) SWITCH
L OFF
H ON