SCES558E July   2004  – January 2025 SN74LVC2G14-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Description
  4. Pin Configuration and Functions
  5. Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, –40°C to 85°C
    7. 4.7 Switching Characteristics, –40°C to 125°C
    8. 4.8 Operating Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 CMOS Schmitt-Trigger Inputs
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Typical Application
        1. 7.1.1.1 Design Requirements
          1. 7.1.1.1.1 Power Considerations
          2. 7.1.1.1.2 Input Considerations
          3. 7.1.1.1.3 Output Considerations
        2. 7.1.1.2 Detailed Design Procedure
        3. 7.1.1.3 Application Curve
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Example

SN74LVC2G14-Q1 Example Trace Corners for Improved
                                        Signal Integrity Figure 7-3 Example Trace Corners for Improved Signal Integrity
SN74LVC2G14-Q1 Example Bypass Capacitor Placement for TSSOP and
                                                Similar PackagesFigure 7-4 Example Bypass Capacitor Placement for TSSOP and Similar Packages
SN74LVC2G14-Q1 Example Bypass Capacitor Placement for SOT, SC70
                                                and Similar PackagesFigure 7-6 Example Bypass Capacitor Placement for SOT, SC70 and Similar Packages
SN74LVC2G14-Q1 Example Bypass Capacitor Placement for WQFN and
                                                Similar PackagesFigure 7-5 Example Bypass Capacitor Placement for WQFN and Similar Packages
SN74LVC2G14-Q1 Example
                                        Damping Resistor Placement for Improved Signal
                                        Integrity Figure 7-7 Example Damping Resistor Placement for Improved Signal Integrity