SLLS562O august   2009  – july 2023 SN65HVD3082E , SN65HVD3085E , SN65HVD3088E , SN75HVD3082E

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information, SN65HVD308xE
    5. 6.5  Thermal Information, SNx5HVD3082E
    6. 6.6  Electrical Characteristics: Driver
    7. 6.7  Electrical Characteristics: Receiver
    8. 6.8  Electrical Characteristics
    9. 6.9  Switching Characteristics: Driver
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
        4. 9.2.1.4 Receiver Fail-safe
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Usage in an RS-485 Transceiver
        2. 9.2.2.2 Low-Power Shutdown Mode
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations for IC Packages
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision N (June 2023) to Revision O (July 2023)

Changes from Revision M (February 2022) to Revision N (June 2023)

  • Changed the Device Information table to the Package Information table. Added the NS packageGo
  • Added the SN65HVD3088E NS packageGo
  • Added the NS package values to the Thermal Information, SN65HVD308xE tableGo

Changes from Revision L (November 2021) to Revision M (February 2022)

Changes from Revision K (July 2021) to Revision L (November 2021)

  • Deleted Feature: Available in a small MSOP-8 package Go
  • Deleted Available in a Small MSOP-8 Package from the titleGo
  • Changed the ψJT D package value from 78.8 to 8.8 in the Thermal Information, SNx5HVD3082E Go

Changes from Revision J (October 2017) to Revision K (July 2021)

  • Changed the Thermal Information tablesGo

Changes from Revision I (September 2016) to Revision J (October 2017)

Changes from Revision H (August 2015) to Revision I (September 2016)

  • Added text to the Description, "The D package version of the SN65HVD3082E has been characterized for operation from -40°C to 105°C."Go
  • Changed the Operating free-air temperature for SN65HVD3082E (D package) From: MAX = 85°C To: 105°C in Section 6.3 Go

Changes from Revision G (May 2009) to Revision H (August 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted Dissipation Ratings table Go
  • Deleted Package Thermal Information table Go

Changes from Revision F (March 2009) to Revision G (May 2009)

  • Corrected unit value from Mv to °C per customer feedbackGo
  • Added Graph - Driver Rise and Fall Time vs Temperature Go
  • Added IDLE Bus to the Function TableGo
  • Added Receiver Fail-safe sectionGo