SLOS795F September   2013  – October 2017 TAS5414C-Q1 , TAS5424C-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for I2C Interface Signals
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descption
      1. 7.3.1  Preamplifier
      2. 7.3.2  Pulse-Width Modulator (PWM)
      3. 7.3.3  Gate Drive
      4. 7.3.4  Power FETs
      5. 7.3.5  Load Diagnostics
      6. 7.3.6  Protection and Monitoring
      7. 7.3.7  I2C Serial Communication Bus
      8. 7.3.8  I2C Bus Protocol
      9. 7.3.9  Hardware Control Pins
      10. 7.3.10 AM Radio Avoidance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Audio Shutdown and Restart Sequence
      2. 7.4.2 Latched-Fault Shutdown and Restart Sequence Control
    5. 7.5 Programming
      1. 7.5.1 Random Write
      2. 7.5.2 Sequential Write
      3. 7.5.3 Random Read
      4. 7.5.4 Sequential Read
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Hardware and Software Design
        2. 8.2.2.2 Parallel Operation (PBTL)
        3. 8.2.2.3 Input Filter Design
        4. 8.2.2.4 Amplifier Output Filtering
        5. 8.2.2.5 Line Driver Applications
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
    4. 10.4 Electrical Connection of Heat Slug and Heat Sink
    5. 10.5 EMI Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PHD|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now.

Table 26. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TAS5414C-Q1 Click here Click here Click here Click here Click here
TAS5424C-Q1 Click here Click here Click here Click here Click here

11.3 Trademarks

All trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.