SLLSFM8B February   2021  – November 2021 TCAN1057A-Q1 , TCAN1057AV-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings Table — IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Characteristics
    6. 6.6 Supply Characteristics
    7. 6.7 Dissipation Ratings
    8. 6.8 Electrical Characteristics
    9. 6.9 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Description
        1. 8.3.1.1 TXD
        2. 8.3.1.2 GND
        3. 8.3.1.3 VCC
        4. 8.3.1.4 RXD
        5. 8.3.1.5 VIO
        6. 8.3.1.6 CANH and CANL
        7. 8.3.1.7 S (Silent)
      2. 8.3.2 CAN Bus States
      3. 8.3.3 TXD Dominant Timeout (DTO)
      4. 8.3.4 CAN Bus short-circuit current limiting
      5. 8.3.5 Thermal Shutdown (TSD)
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Unpowered Device
      8. 8.3.8 Floating pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
      2. 8.4.2 Normal Mode
      3. 8.4.3 Silent Mode
      4. 8.4.4 Driver and Receiver Function
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 CAN Termination
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
      3. 9.2.3 Application Curves
      4. 9.2.4 System Examples
  10. 10Power Supply Recommendations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Characteristics

THERMAL METRIC(1) TCAN1057Ax-Q1 UNIT
D (SOIC) DDF (SOT) DRB (VSON)
RθJA Junction-to-ambient thermal resistance 127.5 122 55.2 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 67.6 63 62.4 ℃/W
RθJB Junction-to-board thermal resistance 70.9 42.4 27.5 ℃/W
ΨJT Junction-to-top characterization parameter 19.3 2.4 2.3 ℃/W
ΨJB Junction-to-board characterization parameter 70.2 42.2 27.4 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance -- -- 11.5 ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.