SLLSG43 October   2026 TCAN957-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings, IEC Specification
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Characteristics
    6. 6.6  Power Supply Characteristics
    7. 6.7  Dissipation Ratings
    8. 6.8  Electrical Characteristics
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Description
        1. 8.3.1.1 TXD
        2. 8.3.1.2 GND
        3. 8.3.1.3 VCC
        4. 8.3.1.4 RXD
        5. 8.3.1.5 VIO
        6. 8.3.1.6 CANH and CANL
        7. 8.3.1.7 S (Silent)
      2. 8.3.2 CAN Bus States
      3. 8.3.3 TXD Dominant Timeout (DTO)
      4. 8.3.4 CAN Bus Short-Circuit Current Limiting
      5. 8.3.5 Thermal Shutdown (TSD)
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Unpowered Device
      8. 8.3.8 Floating Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
      2. 8.4.2 Normal Mode
      3. 8.4.3 Silent Mode
      4. 8.4.4 Driver and Receiver Function
  10. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
        1. 9.1.1.1 CAN Termination
      2. 9.1.2 Detailed Design Procedures
        1. 9.1.2.1 Bus Loading, Length, and Number of Nodes
      3. 9.1.3 Application Curve
    2. 9.2 System Examples
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

TCAN957-Q1 D Package, 8-Pin SOIC (Top View)Figure 5-1 D Package, 8-Pin SOIC
(Top View)
TCAN957-Q1 DRB Package, 8-Pin VSON (Top View)Figure 5-2 DRB Package, 8-Pin VSON
(Top View)
Table 5-1 Pin Functions
PINSTYPEDESCRIPTION
NAMENO.
TXD1Digital InputCAN transmit data input, integrated pullup
GND2GNDGround connection
VCC3Supply5V supply voltage
RXD4Digital OutputCAN receive data output, tri-state when powered off
NC5—No connect (not internally connected); devices without VIO
VIOSupplyI/O supply voltage
CANL6Bus IOLow-level CAN bus input/output line
CANH7Bus IOHigh-level CAN bus input/output line
S8Digital InputSilent mode control input, integrated pull-up
Thermal Pad (VSON only)—Connect the thermal pad to any internal PCB ground plane using multiple vias for best thermal performance.