SPRSPB4C June   2024  – August 2026 TDA4APE-Q1 , TDA4VPE-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      11
      2.      12
    3. 5.3 Signal Descriptions
      1.      14
      2. 5.3.1  ADC
        1. 5.3.1.1 MCU Domain
          1.        17
          2.        18
          3.        19
      3. 5.3.2  CPSW2G
        1. 5.3.2.1 MAIN Domain
          1.        22
        2. 5.3.2.2 MCU Domain
          1.        24
      4. 5.3.3  CPTS
        1. 5.3.3.1 MAIN Domain
          1.        27
        2. 5.3.3.2 MCU Domain
          1.        29
      5. 5.3.4  CSI
        1. 5.3.4.1 MAIN Domain
          1.        32
          2.        33
          3.        34
      6. 5.3.5  DDRSS
        1. 5.3.5.1 MAIN Domain
          1.        37
          2.        38
      7. 5.3.6  Display Port
        1. 5.3.6.1 MAIN Domain
          1.        41
      8. 5.3.7  DMTIMER
        1. 5.3.7.1 MAIN Domain
          1.        44
        2. 5.3.7.2 MCU Domain
          1.        46
      9. 5.3.8  DSI
        1. 5.3.8.1 MAIN Domain
          1.        49
          2.        50
      10. 5.3.9  DSS
        1. 5.3.9.1 MAIN Domain
          1.        53
      11. 5.3.10 ECAP
        1. 5.3.10.1 MAIN Domain
          1.        56
          2.        57
          3.        58
      12. 5.3.11 EPWM
        1. 5.3.11.1 MAIN Domain
          1.        61
          2.        62
          3.        63
          4.        64
          5.        65
          6.        66
          7.        67
      13. 5.3.12 EQEP
        1. 5.3.12.1 MAIN Domain
          1.        70
          2.        71
          3.        72
      14. 5.3.13 GPIO
        1. 5.3.13.1 MAIN Domain
          1.        75
        2. 5.3.13.2 WKUP Domain
          1.        77
      15. 5.3.14 GPMC
        1. 5.3.14.1 MAIN Domain
          1.        80
      16. 5.3.15 HYPERBUS
        1. 5.3.15.1 MCU Domain
          1.        83
      17. 5.3.16 I2C
        1. 5.3.16.1 MAIN Domain
          1.        86
          2.        87
          3.        88
          4.        89
          5.        90
          6.        91
          7.        92
        2. 5.3.16.2 MCU Domain
          1.        94
          2.        95
        3. 5.3.16.3 WKUP Domain
          1.        97
      18. 5.3.17 I3C
        1. 5.3.17.1 MCU Domain
          1.        100
      19. 5.3.18 MCAN
        1. 5.3.18.1 MAIN Domain
          1.        103
          2.        104
          3.        105
          4.        106
          5.        107
          6.        108
          7.        109
          8.        110
          9.        111
          10.        112
          11.        113
          12.        114
          13.        115
          14.        116
          15.        117
          16.        118
          17.        119
          18.        120
        2. 5.3.18.2 MCU Domain
          1.        122
          2.        123
      20. 5.3.19 MCASP
        1. 5.3.19.1 MAIN Domain
          1.        126
          2.        127
          3.        128
          4.        129
          5.        130
      21. 5.3.20 MCSPI
        1. 5.3.20.1 MAIN Domain
          1.        133
          2.        134
          3.        135
          4.        136
          5.        137
          6.        138
          7.        139
        2. 5.3.20.2 MCU Domain
          1.        141
          2.        142
      22. 5.3.21 MDIO
        1. 5.3.21.1 MAIN Domain
          1.        145
          2.        146
        2. 5.3.21.2 MCU Domain
          1.        148
      23. 5.3.22 MMC
        1. 5.3.22.1 MAIN Domain
          1.        151
          2.        152
      24. 5.3.23 OSPI
        1. 5.3.23.1 MCU Domain
          1.        155
          2.        156
      25. 5.3.24 PCIE
        1. 5.3.24.1 MAIN Domain
          1.        159
      26. 5.3.25 SERDES
        1. 5.3.25.1 MAIN Domain
          1.        162
          2.        163
          3.        164
      27. 5.3.26 SGMII
        1. 5.3.26.1 MAIN Domain
          1.        167
      28. 5.3.27 UART
        1. 5.3.27.1 MAIN Domain
          1.        170
          2.        171
          3.        172
          4.        173
          5.        174
          6.        175
          7.        176
          8.        177
          9.        178
          10.        179
        2. 5.3.27.2 MCU Domain
          1.        181
        3. 5.3.27.3 WKUP Domain
          1.        183
      29. 5.3.28 UFS
        1. 5.3.28.1 MAIN Domain
          1.        186
      30. 5.3.29 USB
        1. 5.3.29.1 MAIN Domain
          1.        189
      31. 5.3.30 Emulation and Debug
        1. 5.3.30.1 MAIN Domain
          1.        192
          2.        193
      32. 5.3.31 System and Miscellaneous
        1. 5.3.31.1 Boot Mode Configuration
          1.        196
        2. 5.3.31.2 Clock
          1.        198
          2.        199
        3. 5.3.31.3 EFUSE
          1.        201
        4. 5.3.31.4 System
          1.        203
          2.        204
        5. 5.3.31.5 VMON
          1.        206
      33. 5.3.32 Power
        1.       208
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Power-On-Hour (POH) Limits
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Operating Performance Points
    6. 6.6  Electrical Characteristics
      1. 6.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 6.6.3  HFOSC/LFOSC Electrical Characteristics
      4. 6.6.4  eMMCPHY Electrical Characteristics
      5. 6.6.5  SDIO Electrical Characteristics
      6. 6.6.6  CSI2/DSI D-PHY Electrical Characteristics
      7. 6.6.7  ADC12B Electrical Characteristics
      8. 6.6.8  LVCMOS Electrical Characteristics
      9. 6.6.9  USB2PHY Electrical Characteristics
      10. 6.6.10 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      11. 6.6.11 UFS M-PHY Electrical Characteristics
      12. 6.6.12 eDP/DP AUX-PHY Electrical Characteristics
      13. 6.6.13 DDR0 Electrical Characteristics
    7. 6.7  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8  Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics for AND Package
    9. 6.9  Temperature Sensor Characteristics
    10. 6.10 Timing and Switching Characteristics
      1. 6.10.1 Timing Parameters and Information
      2. 6.10.2 Power Supply Sequencing
        1. 6.10.2.1  Power Supply Slew Rate Requirement
        2. 6.10.2.2  Combined MCU and Main Domains Power- Up Sequencing
        3. 6.10.2.3  Combined MCU and Main Domains Power- Down Sequencing - Option 1
        4. 6.10.2.4  Combined MCU and Main Domains Power- Down Sequencing - Option 2
        5. 6.10.2.5  Isolated MCU and Main Domains Power- Up Sequencing
        6. 6.10.2.6  Isolated MCU and Main Domains Power- Down Sequencing - Option 1
        7. 6.10.2.7  Isolated MCU and Main Domains Power- Down Sequencing - Option 2
        8. 6.10.2.8  Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        9. 6.10.2.9  Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        10. 6.10.2.10 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 6.10.3 System Timing
        1. 6.10.3.1 Reset Timing
        2. 6.10.3.2 Safety Signal Timing
        3. 6.10.3.3 Clock Timing
      4. 6.10.4 Clock Specifications
        1. 6.10.4.1 Input and Output Clocks / Oscillators
          1. 6.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 6.10.4.1.1.1 Load Capacitance
            2. 6.10.4.1.1.2 Shunt Capacitance
          2. 6.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 6.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 6.10.4.1.3.1 Load Capacitance
            2. 6.10.4.1.3.2 Shunt Capacitance
          4. 6.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 6.10.4.1.5 Auxiliary OSC1 Not Used
        2. 6.10.4.2 Output Clocks
        3. 6.10.4.3 PLLs
        4. 6.10.4.4 Module and Peripheral Clocks Frequencies
      5. 6.10.5 Peripherals
        1. 6.10.5.1  ATL
          1. 6.10.5.1.1 ATL_PCLK Timing Requirements
          2. 6.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.10.5.2  CPSW2G
          1. 6.10.5.2.1 CPSW2G MDIO Interface Timings
          2. 6.10.5.2.2 CPSW2G RMII Timings
            1. 6.10.5.2.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 6.10.5.2.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 6.10.5.2.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 6.10.5.2.3 CPSW2G RGMII Timings
            1. 6.10.5.2.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 6.10.5.2.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 6.10.5.2.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 6.10.5.2.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        3. 6.10.5.3  CSI-2
        4. 6.10.5.4  DDRSS
        5. 6.10.5.5  DSS
        6. 6.10.5.6  eCAP
          1. 6.10.5.6.1 Timing Requirements for eCAP
          2. 6.10.5.6.2 Switching Characteristics for eCAP
        7. 6.10.5.7  EPWM
          1. 6.10.5.7.1 Timing Requirements for eHRPWM
          2. 6.10.5.7.2 Switching Characteristics for eHRPWM
        8. 6.10.5.8  eQEP
          1. 6.10.5.8.1 Timing Requirements for eQEP
          2. 6.10.5.8.2 Switching Characteristics for eQEP
        9. 6.10.5.9  GPIO
          1. 6.10.5.9.1 GPIO Timing Requirements
          2. 6.10.5.9.2 GPIO Switching Characteristics
        10. 6.10.5.10 GPMC
          1. 6.10.5.10.1 GPMC and NOR Flash — Synchronous Mode
            1. 6.10.5.10.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 6.10.5.10.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 6.10.5.10.2 GPMC and NOR Flash — Asynchronous Mode
            1. 6.10.5.10.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 6.10.5.10.3 GPMC and NAND Flash — Asynchronous Mode
            1. 6.10.5.10.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 6.10.5.10.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 6.10.5.10.4 GPMC0 IOSET
        11. 6.10.5.11 HyperBus
          1. 6.10.5.11.1 Timing Requirements for HyperBus
          2. 6.10.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 6.10.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 6.10.5.12 I2C
        13. 6.10.5.13 I3C
        14. 6.10.5.14 MCAN
        15. 6.10.5.15 MCASP
        16. 6.10.5.16 MCSPI
          1. 6.10.5.16.1 MCSPI — Controller Mode
          2. 6.10.5.16.2 MCSPI — Peripheral Mode
        17. 6.10.5.17 MMCSD
          1. 6.10.5.17.1 MMC0 - eMMC Interface
            1. 6.10.5.17.1.1 Legacy SDR Mode
            2. 6.10.5.17.1.2 High Speed SDR Mode
            3. 6.10.5.17.1.3 High Speed DDR Mode
            4. 6.10.5.17.1.4 HS200 Mode
            5. 6.10.5.17.1.5 HS400 Mode
          2. 6.10.5.17.2 MMC1 - SD/SDIO Interface
            1. 6.10.5.17.2.1 Default Speed Mode
            2. 6.10.5.17.2.2 High Speed Mode
            3. 6.10.5.17.2.3 UHS–I SDR12 Mode
            4. 6.10.5.17.2.4 UHS–I SDR25 Mode
            5. 6.10.5.17.2.5 UHS–I SDR50 Mode
            6. 6.10.5.17.2.6 UHS–I DDR50 Mode
            7. 6.10.5.17.2.7 UHS–I SDR104 Mode
        18. 6.10.5.18 CPTS
          1. 6.10.5.18.1 CPTS Timing Requirements
          2. 6.10.5.18.2 CPTS Switching Characteristics
        19. 6.10.5.19 OSPI
          1. 6.10.5.19.1 OSPI0/1 PHY Mode
            1. 6.10.5.19.1.1 OSPI0/1 With PHY Data Training
            2. 6.10.5.19.1.2 OSPI Without Data Training
              1. 6.10.5.19.1.2.1 OSPI Timing Requirements – SDR Mode
              2. 6.10.5.19.1.2.2 OSPI Switching Characteristics – SDR Mode
              3. 6.10.5.19.1.2.3 OSPI Timing Requirements – DDR Mode
              4. 6.10.5.19.1.2.4 OSPI Switching Characteristics – PHY DDR Mode
          2. 6.10.5.19.2 OSPI0/1 Tap Mode
            1. 6.10.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.10.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.10.5.20 OLDI
          1. 6.10.5.20.1 OLDI Switching Characteristics
        21. 6.10.5.21 PCIE
        22. 6.10.5.22 Timers
          1. 6.10.5.22.1 Timing Requirements for Timers
          2. 6.10.5.22.2 Switching Characteristics for Timers
        23. 6.10.5.23 UART
          1. 6.10.5.23.1 Timing Requirements for UART
          2. 6.10.5.23.2 UART Switching Characteristics
        24. 6.10.5.24 USB
      6. 6.10.6 Emulation and Debug
        1. 6.10.6.1 Trace
        2. 6.10.6.2 JTAG
          1. 6.10.6.2.1 JTAG Electrical Data and Timing
            1. 6.10.6.2.1.1 JTAG Timing Requirements
            2. 6.10.6.2.1.2 JTAG Switching Characteristics
  8. 7 Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
        1. 7.1.1.1 Power Distribution Network Implementation Guidance
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG and EMU
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 Hardware Design Guide for JacintoTM 7 Devices
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 7.2.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 7.2.2.1 No Loopback and Internal Pad Loopback
        2. 7.2.2.2 External Board Loopback
        3. 7.2.2.3 DQS (only available in Octal Flash devices)
      3. 7.2.3 USB VBUS Design Guidelines
      4. 7.2.4 System Power Supply Monitor Design Guidelines using VMON/POK
      5. 7.2.5 High Speed Differential Signal Routing Guidance
      6. 7.2.6 Thermal Solution Guidance
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AND|1063
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 VPP Specifications for One-Time Programmable (OTP) eFuses

This section specifies the operating conditions required for programming the OTP eFuses and is applicable only for High-Security Devices.