SLLSEZ1C September   2017  – May 2019 TDP142

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematics
      2.      Display
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Supply Characteristics
    6. 6.6  DC Electrical Characteristics
    7. 6.7  AC Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DisplayPort
      2. 8.3.2 4-level Inputs
      3. 8.3.3 Receiver Linear Equalization
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Configuration in GPIO Mode
      2. 8.4.2 Device Configuration In I2C Mode
      3. 8.4.3 Linear EQ Configuration
      4. 8.4.4 Operation Timing – Power Up
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 General Register (address = 0x0A) [reset = 00000001]
        1. Table 6. General Registers
      2. 8.6.2 DisplayPort Control/Status Registers (address = 0x10) [reset = 00000000]
        1. Table 7. DisplayPort Control/Status Registers (0x10)
      3. 8.6.3 DisplayPort Control/Status Registers (address = 0x11) [reset = 00000000]
        1. Table 8. DisplayPort Control/Status Registers (0x11)
      4. 8.6.4 DisplayPort Control/Status Registers (address = 0x12) [reset = 00000000]
        1. Table 9. DisplayPort Control/Status Registers (0x12)
      5. 8.6.5 DisplayPort Control/Status Registers (address = 0x13) [reset = 00000000]
        1. Table 10. DisplayPort Control/Status Registers (0x13)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Source Application Implementation
        1. 9.2.1.1 Design Requirement
        2. 9.2.1.2 Detail Design Procedure
      2. 9.2.2 Sink Application Implementation
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.4 Operation Timing – Power Up

TDP142 Power_timing_digarm.gifFigure 10. Power-Up Timing

Table 3. Power-Up Timing(1)(2)

PARAMETER MIN MAX UNIT
td_pg VCC (minimum) to Internal Power Good asserted high 500 µs
tcfg_su CFG(1) pins setup(2) 50 µs
tcfg_hd CFG(1) pins hold 10 µs
tVCC_RAMP VCC supply ramp requirement 100 ms
(1) Following pins comprise CFG pins: I2C_EN, DPEQ[1:0].
(2) Recommend CFG pins are stable when VCC is at min.