SLOS829A February   2013  – July 2015 THS4532

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = 2.7 V
    6. 7.6 Electrical Characteristics: VS = 5 V
    7. 7.7 Typical Characteristics
      1. 7.7.1 Typical Characteristics: VS = 2.7 V
      2. 7.7.2 Typical Characteristics: VS = 5 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Common-Mode Voltage Range
        1. 8.3.1.1 Setting the Output Common-Mode Voltage
      2. 8.3.2 Power Down
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1  Frequency Response and Output Impedance
      2. 9.1.2  Distortion
      3. 9.1.3  Slew Rate, Transient Response, Settling Time, Overdrive, Output Voltage, and Turnon and Turnoff Time
      4. 9.1.4  Common-Mode and Power Supply Rejection
      5. 9.1.5  VOCM Input
      6. 9.1.6  Balance Error
      7. 9.1.7  Single-Supply Operation
      8. 9.1.8  Low-Power Applications and the Effects of Resistor Values on Bandwidth
      9. 9.1.9  Driving Capacitive Loads
      10. 9.1.10 Audio Performance
      11. 9.1.11 Audio On and Off Pop Performance
    2. 9.2 Typical Applications
      1. 9.2.1 SAR ADC Performance: THS5432 and ADS8321 Combined Performance
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Audio ADC Driver Performance: THS5432 and PCM4204 Combined Performance
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 SAR ADC Performance: THS5432 and ADS7945 Combined Performance
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
    3. 9.3 Systems Examples
      1. 9.3.1 Differential-Input to Differential-Output Amplifier
        1. 9.3.1.1 AC-Coupled, Differential-Input to Differential-Output Design Issues
      2. 9.3.2 Single-Ended to Differential FDA Configuration
        1. 9.3.2.1 Input Impedance
      3. 9.3.3 Single-Ended Input to Differential Output Amplifier
        1. 9.3.3.1 AC-Coupled Signal Path Considerations for Single-Ended Input to Differential Output Conversion
        2. 9.3.3.2 DC-Coupled Input Signal Path Considerations for Single-Ended to Differential Conversion
        3. 9.3.3.3 Resistor Design Equations for the Single-Ended to Differential Configuration of the FDA
      4. 9.3.4 Differential Input to Single-Ended Output Amplifier
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

The THS4532 EVM (SLOU356) should be used as a reference when designing the circuit board. TI recommends following the EVM layout of the external components near to the amplifier, ground plane construction, and power routing as closely as possible. General guidelines are:

  1. Signal routing should be direct and as short as possible into and out of the amplifier.
  2. The feedback path should be short and direct avoiding vias if possible.
  3. Ground or power planes should be removed from directly under the amplifier’s input and output pins.
  4. A series output resistor is recommended to be placed as near to the output pin as possible. See Figure 79 for recommended values given expected capacitive load of design.
  5. A 2.2-µF power supply decoupling capacitor should be placed within 2 inches of the device and can be shared with other amplifiers. For split supply, a capacitor is required for both supplies.
  6. A 0.1-µF power supply decoupling capacitor should be placed as near to the power supply pins as possible. Preferably within 0.1 inch. For split supply, a capacitor is required for both supplies.
  7. The PD pin uses TTL logic levels referenced to the negative supply voltage (VS-). When not used it should tied to the positive supply to enable the amplifier. When used, it must be actively driven high or low and should not be left in an indeterminate logic state. A bypass capacitor is not required, but can be used for robustness in noisy environments.

11.2 Layout Example

Figure 100 through Figure 103 illustrate the PCB layers of the EVM.

THS4532 THS4532_top_lay_2_slos829.gifFigure 100. THS4532 EVM Top Layer 1
THS4532 EVM_gnd_lyr_2_fig4_slos829.gifFigure 101. THS4532 EVM Ground Layer 2
THS4532 gnd_lyr_3_fig5_slos829.gifFigure 102. THS4532 EVM Ground Layer 3
THS4532 EVM_gnd_lyr_3_slos829.gifFigure 103. THS4532 EVM Bottom Layer 4