SLOS451C December   2004  – March 2025 THS4631

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Transimpedance Fundamentals
      2. 8.1.2 Noise Analysis
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband Photodiode Transimpedance Amplifier
        1. 8.2.1.1 Detailed Design Procedure
          1. 8.2.1.1.1 Designing the Transimpedance Circuit
          2. 8.2.1.1.2 Measuring Transimpedance Bandwidth
          3. 8.2.1.1.3 Summary of Key Decisions in Transimpedance Design
          4. 8.2.1.1.4 Selection of Feedback Resistors
        2. 8.2.1.2 Application Curves
      2. 8.2.2 Alternative Transimpedance Configurations
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Slew-Rate Performance With Varying Input-Step Amplitude and Rise-and-Fall Time
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Printed-Circuit Board (PCB) Layout Techniques for High Performance
        2. 8.4.1.2 PowerPAD Design Considerations
        3. 8.4.1.3 PowerPAD PCB Layout Considerations
        4. 8.4.1.4 Power Dissipation and Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Design Tools Evaluation Fixture, Spice Models, and Applications Support
        1. 9.1.1.1 Bill of Materials
        2. 9.1.1.2 EVM
        3. 9.1.1.3 EVM Warnings and Restrictions
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.2 Layout Example

Although there are many ways to properly dissipate heat in the PowerPAD integrated circuit package, the following steps illustrate the recommended approach.

THS4631 DGN PowerPAD™ Integrated Circuit Package PCB Etch and Via Pattern Figure 8-14 DGN PowerPAD™ Integrated Circuit Package PCB Etch and Via Pattern
THS4631 DDA PowerPAD™ Integrated Circuit Package PCB Etch and Via Pattern Figure 8-15 DDA PowerPAD™ Integrated Circuit Package PCB Etch and Via Pattern